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hermetically sealed container
Hermetic Packages manufacturer
hermetic packages electronics

PRODUCTS

We specialize in the development and manufacturing of diverse metal packaging and electronic components.
At Jitai, we aim to uphold structural integrity in demanding conditions while minimizing optical insertion loss in opto-electronic packages. Our range includes various shapes and sizes, each featuring multiple opto-channel design choices. We employ a range of forming and fabrication techniques tailored to specific production requirements.
 

Technical Parameters:

Hermeticity

≤  1 x 10-3  Pa * cm3 /s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

 ≥1× 109 Ω (500V DC) ceramic

Salt Spray Test

24h

Flatness

≤ 0.05mm

Roughness

0.8μm

Plating Quality Test

N450±10°C, 15 min

Temperature Cycling

-55°C to 125°C, 20 cycles

Thermal Shock

-55°C to 125°C, 20 cycles

Mechanical Shock

Condition B, Y1 Direction, 10,000g

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ApplicationsAll kins of high power thick and thin film hybrid circuits.

Materials used: 10# steel, oxygen-free copper, tungsten-copper, etc., all of which have great heat dissipation performance.

Technial parameters

Sealing Method

Parallel Seam Welding. Laser Welding

Housing materials

10# steel, tungsten copper, molybdenum copper, oxygen-free copper, etc.

Lead materials

4J50 copper core, 4J29 copper core, 4J50, oxygen-free copper, zirconium copper, etc.

Insulation resistance

500VDC, insulation resistance between single lead and housing 1×1010

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Applications Phased array radar systems, millimeter wave imaging, satellite communications, remote sensing and other fields.

Technial parameters

Materials

Kovar, tungsent-copper, copper oxide, etc

Frequency

0-50GHz

VSWR

<1.2

Impedance ratio

50

Insulation resistance

500V DC, insulation resistance between single lead and housing 1×1010

Hemeticity

Air leakage rate1×10-3Pam3/s

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Applications:All kinds of monolithic integrated circuits and hybrid integrated circuit packaging.
Materials used: Kovar, 42 alloy, #10 steel

HIC Packages

Structures

Machined/Stamped/Welded

Design

Platform/Sidewall

Materials

Kovar/Alloy42/CRS

Leads

Cylindrical/Straight/Bent

Lead Layouts

DIP/Quad Inline

Insulator

BH Series/Elan #13/DM-305

Lid Sealing Design

Percussion Welding/Tin Welding/Laser Welding

Plating

Ni,Au/Ni

Insulation Resistance

500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω

Hermeticity

Leak rate is ≤1×10^-3 Pa·cm 3/s

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●Hermeticity: Must adhere to an airtightness requirement of ≤1×10-3Pa·cm3/s, as confirmed during fluctuating high-pressure testing.
●Insulation: Lead-to-housing insulation resistance must be ≥1×109Ω.
●Bonding: Inner wire bonding.
●Solderability: Shell surface should exhibit properties conducive to easy solderability.



 
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Transistor Outline (TO) packages consist of two parts: the TO header and the TO cap. We offer various standard TO connector shapes and sizes such as TO5, TO9, TO18, TO38, TO39, TO46, TO56, TO60 and TO65.Additionally, our R&D team can collaborate with clients to develop customized solutions.
 

TO Test Parameters:

Hermeticity

Leak rate is ≤1×10-3 Pa·cm 3/s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

Bending Resistance Test

Leads are bent to 90°, 3mm from substrate

Tensile Strength Test

1.5Kg weight is connected to lead for 30 seconds

Solderability Test

 Lead-free tin heated to 245 ℃±5 ℃ with KS-C-5W flux; immersion time 3 seconds

Pure Water Test

Immersion in deionized water at 25℃±5℃ for 24 hours

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WHO WE ARE

  • With 23 years of experience in producing hermetic packages, Jitai ranks among China's most established manufacturers in the industry.
  • We have three fully-staffed R&D teams available for independent or collaborative work on large-scale projects.
  • We frequently invite domestic experts from leading universities like Tsinghua to train our R&D team on emerging technological trends.
  • ISO9001 certified
  • Meets military specifications
  • We have 11,000 square meters of state-of-the-art facilities completed.
We possess mass production capabilities and maintain consistent partnerships with over 30 machining suppliers.
6 chain-conveyer furnaces     ● 2 manual plating lines
4 diffusion furnaces      ● 1 automatic plating line
TECHNICAL-ADVANTAGES
 
TECHNICAL ADVANTAGES
●  With roots as a plating facility over 30 years ago, Jitai has honed proprietary techniques for unparalleled precision.
●  Proud recipients of 38 domestic technological patents, showcasing our commitment to innovation and excellence.
IN-2020-TOTAL-OUTPUT-VALUE-EXCEEDED-100-MILLION-RMB
 
PRICE ADVANTAGES
●  Leveraging decades of industry experience, we've optimized production with standardized quality assurance at every stage, 
efficient yield-boosting solutions, 
and meticulous cost control methodologies.
AWARDED-MORE-THAN-20-NATIONAL-PATENTS
 
PRODUCT ADVANTAGES
●  Benefit from our dedicated technical division and reliable customer service team.
●  We accommodate diverse materials, dimensions, and scales, tailoring packages to user or our own specifications.Collaborate with our engineers from R&D inception, ensuring functional, workable, and cost-effective product designs.

APPLICATIONS

Our products are utilized in a wide range of industries, like medical, automotive, industrial lasers, telecommunications, sensors, home appliances, and more.
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FOUNDED IN
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PATENTS
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EMPLOYEES
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MILLION RMB ANNUAL OUTPUT
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PRODUCTS

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   Yixing City Jitai Electronics Co.,Ltd.
   Whatsapp:+86 18916250130
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