Electronic Component packages manufacturer

PRODUCTS

We specialize in the development and manufacturing of diverse metal packaging and electronic components.

Opto-Electronic Packages

WHO WE ARE

With 23 years of experience in producing hermetic packages, Jitai ranks among China's most established manufacturers in the industry.
We have three fully-staffed R&D teams available for independent or collaborative work on large-scale projects.
We frequently invite domestic experts from leading universities like Tsinghua to train our R&D team on emerging technological trends.
ISO9001 certified
Meets military specifications
We have 11,000 square meters of state-of-the-art facilities completed.

We possess mass production capabilities and maintain consistent partnerships with over 30 machining suppliers.

● 6 chain-conveyer furnaces ● 2 manual plating lines
● 4 diffusion furnaces ● 1 automatic plating line

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TECHNICAL ADVANTAGES
● With roots as a plating facility over 30 years ago, Jitai has honed proprietary techniques for unparalleled precision.
● Proud recipients of 38 domestic technological patents, showcasing our commitment to innovation and excellence.

IN-2020-TOTAL-OUTPUT-VALUE-EXCEEDED-100-MILLION-RMB

PRICE ADVANTAGES
● Leveraging decades of industry experience, we've optimized production with standardized quality assurance at every stage,

efficient yield-boosting solutions,

and meticulous cost control methodologies.

PRODUCT ADVANTAGES
● Benefit from our dedicated technical division and reliable customer service team.
● We accommodate diverse materials, dimensions, and scales, tailoring packages to user or our own specifications.Collaborate with our engineers from R&D inception, ensuring functional, workable, and cost-effective product designs.

APPLICATIONS

Our products are utilized in a wide range of industries, like medical, automotive, industrial lasers, telecommunications, sensors, home appliances, and more.

Automobile
Optical Communication
Industrial Lasers
Sensors
Medical Equipment
Home Appliances

FOUNDED IN

PATENTS

EMPLOYEES

MILLION RMB ANNUAL OUTPUT

PRODUCTS

NEWS

TO-5, TO-18, and TO-39: What’s the Difference and Where to Use Each Package

In the world of semiconductors, packaging is far more than a protective shell — it is a vital component that determines how efficiently a device performs, dissipates heat, and survives harsh environments. Among the many standardized metal can packages developed for transistors, sensors, and optoelec

2025-11-04

Comparing SOT, QFN, and DFN: Which SMD Package Fits Your Design?

In the rapidly evolving electronics industry, package selection is as vital as the chip itself. A good package ensures mechanical protection, thermal efficiency, electrical stability, and manufacturability. As devices shrink and gain functionality, engineers must balance space, cost, and reliability

2025-11-04

Glass, Alumina, Kovar: Material Choices in Optoelectronic Packages

Optoelectronic devices—ranging from laser diodes and photodetectors to fiber-optic transceivers—depend heavily on the quality of their packaging. The optoelectronic package protects sensitive chips and optical interfaces from contamination, moisture, and mechanical stress, while ensuring thermal sta

2025-11-03

COB, TO-Can, Butterfly: Choosing the Right Optoelectronic Packages

Optoelectronic packaging refers to the mechanical and thermal structure that houses optical and electronic components, ensuring alignment, protection, and efficient heat dissipation. In applications ranging from data-center communication to industrial sensing, the packaging type significantly affect

2025-11-03

Hermeticity	≤ 1 x 10_-₃ Pa * cm₃/s
Insulation Resistance	≥1× 10₁₀ Ω (500V DC) glass ≥1× 10₉ Ω (500V DC) ceramic
Salt Spray Test	24h
Flatness	≤ 0.05mm
Roughness	0.8μm
Plating Quality Test	N₂450±10°C, 15 min
Temperature Cycling	-55°C to 125°C, 20 cycles
Thermal Shock	-55°C to 125°C, 20 cycles
Mechanical Shock	Condition B, Y1 Direction, 10,000g

Technial parameters
Sealing Method	Parallel Seam Welding. Laser Welding
Housing materials	10# steel, tungsten copper, molybdenum copper, oxygen-free copper, etc.
Lead materials	4J50 copper core, 4J29 copper core, 4J50, oxygen-free copper, zirconium copper, etc.
Insulation resistance	500VDC, insulation resistance between single lead and housing ≥1×1010 Ω

Technial parameters
Materials	Kovar, tungsent-copper, copper oxide, etc
Frequency	0-50GHz
VSWR	<1.2
Impedance ratio	50Ω
Insulation resistance	500V DC, insulation resistance between single lead and housing ≥1×1010 Ω
Hemeticity	Air leakage rate≤1×10-3Pa∙m3/s

HIC Packages
Structures	Machined/Stamped/Welded
Design	Platform/Sidewall
Materials	Kovar/Alloy42/CRS
Leads	Cylindrical/Straight/Bent
Lead Layouts	DIP/Quad Inline
Insulator	BH Series/Elan #13/DM-305
Lid Sealing Design	Percussion Welding/Tin Welding/Laser Welding
Plating	Ni,Au/Ni
Insulation Resistance	500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω
Hermeticity	Leak rate is ≤1×10^-3 Pa·cm 3/s

Hermeticity	Leak rate is ≤1×10-3 Pa·cm 3/s
Insulation Resistance	≥1× 10₁₀ Ω (500V DC) glass
Bending Resistance Test	Leads are bent to 90°, 3mm from substrate
Tensile Strength Test	1.5Kg weight is connected to lead for 30 seconds
Solderability Test	Lead-free tin heated to 245 ℃±5 ℃ with KS-C-5W flux; immersion time 3 seconds
Pure Water Test	Immersion in deionized water at 25℃±5℃ for 24 hours

PRODUCTS

WHO WE ARE

APPLICATIONS

Automobile

Optical Communication

Industrial Lasers

Sensors

Medical Equipment

Home Appliances

NEWS

TO-5, TO-18, and TO-39: What’s the Difference and Where to Use Each Package

Comparing SOT, QFN, and DFN: Which SMD Package Fits Your Design?

Glass, Alumina, Kovar: Material Choices in Optoelectronic Packages

COB, TO-Can, Butterfly: Choosing the Right Optoelectronic Packages