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hermetically sealed container
Hermetic Packages manufacturer
hermetic packages electronics

PRODUCTS

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We specialize in the development and manufacturing of diverse metal packaging and electronic components.
Opto-Electronic Packages
Opto-Electronic Packages
At Jitai, we aim to uphold structural integrity in demanding conditions while minimizing optical insertion loss in opto-electronic packages. Our range includes various shapes and sizes, each featuring multiple opto-channel design choices. We employ a range of forming and fabrication techniques tailored to specific production requirements.
 

Technical Parameters:

Hermeticity

≤  1 x 10-3  Pa * cm3 /s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

 ≥1× 109 Ω (500V DC) ceramic

Salt Spray Test

24h

Flatness

≤ 0.05mm

Roughness

0.8μm

Plating Quality Test

N2 450±10°C, 15 min

Temperature Cycling

-55°C to 125°C, 20 cycles

Thermal Shock

-55°C to 125°C, 20 cycles

Mechanical Shock

Condition B, Y1 Direction, 10,000g
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Power Packages
Power Packages

Applications：All kins of high power thick and thin film hybrid circuits.

Materials used: 10# steel, oxygen-free copper, tungsten-copper, etc., all of which have great heat dissipation performance.

Technial parameters

Sealing Method

Parallel Seam Welding. Laser Welding

Housing materials

10# steel, tungsten copper, molybdenum copper, oxygen-free copper, etc.

Lead materials

4J50 copper core, 4J29 copper core, 4J50, oxygen-free copper, zirconium copper, etc.

Insulation resistance

500VDC, insulation resistance between single lead and housing ≥1×1010 Ω
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Microwave Packages
Microwave Packages

Applications： Phased array radar systems, millimeter wave imaging, satellite communications, remote sensing and other fields.

Technial parameters

Materials

Kovar, tungsent-copper, copper oxide, etc

Frequency

0-50GHz

VSWR

<1.2

Impedance ratio

50Ω

Insulation resistance

500V DC, insulation resistance between single lead and housing ≥1×1010 Ω

Hemeticity

Air leakage rate≤1×10-3Pa∙m3/s
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HIC Packages
HIC Packages

Applications：All kinds of monolithic integrated circuits and hybrid integrated circuit packaging.
Materials used: Kovar, 42 alloy, #10 steel

HIC Packages

Structures

Machined/Stamped/Welded

Design

Platform/Sidewall

Materials

Kovar/Alloy42/CRS

Leads

Cylindrical/Straight/Bent

Lead Layouts

DIP/Quad Inline

Insulator

BH Series/Elan #13/DM-305

Lid Sealing Design

Percussion Welding/Tin Welding/Laser Welding

Plating

Ni,Au/Ni

Insulation Resistance

500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω

Hermeticity

Leak rate is ≤1×10^-3 Pa·cm 3/s
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Sensor Packages
Sensor Packages
●Hermeticity: Must adhere to an airtightness requirement of ≤1×10-3Pa·cm3/s, as confirmed during fluctuating high-pressure testing.
●Insulation: Lead-to-housing insulation resistance must be ≥1×109Ω.
●Bonding: Inner wire bonding.
●Solderability: Shell surface should exhibit properties conducive to easy solderability.



 
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TO Packages
TO Packages
Transistor Outline (TO) packages consist of two parts: the TO header and the TO cap. We offer various standard TO connector shapes and sizes such as TO5, TO9, TO18, TO38, TO39, TO46, TO56, TO60 and TO65.Additionally, our R&D team can collaborate with clients to develop customized solutions.
 

TO Test Parameters:

Hermeticity

Leak rate is ≤1×10-3 Pa·cm 3/s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

Bending Resistance Test

Leads are bent to 90°, 3mm from substrate

Tensile Strength Test

1.5Kg weight is connected to lead for 30 seconds

Solderability Test

 Lead-free tin heated to 245 ℃±5 ℃ with KS-C-5W flux; immersion time 3 seconds

Pure Water Test

Immersion in deionized water at 25℃±5℃ for 24 hours
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WHO WE ARE

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  • With 23 years of experience in producing hermetic packages, Jitai ranks among China's most established manufacturers in the industry.
  • We have three fully-staffed R&D teams available for independent or collaborative work on large-scale projects.
  • We frequently invite domestic experts from leading universities like Tsinghua to train our R&D team on emerging technological trends.
  • ISO9001 certified
  • Meets military specifications
  • We have 11,000 square meters of state-of-the-art facilities completed.
We possess mass production capabilities and maintain consistent partnerships with over 30 machining suppliers.
● 6 chain-conveyer furnaces     ● 2 manual plating lines
● 4 diffusion furnaces      ● 1 automatic plating line
TECHNICAL-ADVANTAGES
 
TECHNICAL ADVANTAGES
●  With roots as a plating facility over 30 years ago, Jitai has honed proprietary techniques for unparalleled precision.
●  Proud recipients of 38 domestic technological patents, showcasing our commitment to innovation and excellence.
IN-2020-TOTAL-OUTPUT-VALUE-EXCEEDED-100-MILLION-RMB
 
PRICE ADVANTAGES
●  Leveraging decades of industry experience, we've optimized production with standardized quality assurance at every stage, 
efficient yield-boosting solutions, 
and meticulous cost control methodologies.
AWARDED-MORE-THAN-20-NATIONAL-PATENTS
 
PRODUCT ADVANTAGES
●  Benefit from our dedicated technical division and reliable customer service team.
●  We accommodate diverse materials, dimensions, and scales, tailoring packages to user or our own specifications.Collaborate with our engineers from R&D inception, ensuring functional, workable, and cost-effective product designs.

APPLICATIONS

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Our products are utilized in a wide range of industries, like medical, automotive, industrial lasers, telecommunications, sensors, home appliances, and more.
  • automobile

    Automobile
  • Optical-Communication

    Optical Communication
  • Industrial-Lasers

    Industrial Lasers
  • sensors

    Sensors
  • medical-treatment

    Medical Equipment
  • Home-Appliances

    Home Appliances
FOUNDED-IN-1998
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FOUNDED IN
PATENTS
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PATENTS
EMPLOYEES
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EMPLOYEES
MILLION-RMB-ANNUAL-OUTPUT
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MILLION RMB ANNUAL OUTPUT
PRODUCTS
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PRODUCTS

NEWS

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TO-18 vs TO-46 vs TO-56: How to Choose the Right Package?

TO-18, TO-46, and TO-56 are common TO metal can packages used in semiconductor and optoelectronic devices.

2026-04-17
TO Packages vs Butterfly Packages.jpg
TO Packages vs Butterfly Packages: Which One Should You Choose?

Semiconductor packaging does more than protect devices—it affects performance, reliability, heat dissipation, and integration. Among many options, TO packages are widely used in traditional electronics and power devices, while Butterfly packages are designed for advanced optical and photonic applica

2026-04-17
Transistor Outline Packages.png
9 Common Challenges in TO Package Selection and How to Avoid Them

TO packages remain a trusted choice for transistors, diodes, sensors, and power devices because of their durability and proven performance. However, selecting the right TO package requires balancing thermal, electrical, mechanical, manufacturing, and supply factors to avoid overheating, reliability

2026-04-17
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CLCC vs. CQFP vs. CBGA: Which Ceramic Package Best Fits Your Application?

Choosing the right ceramic package is essential for performance, reliability, and cost-effectiveness. Understanding the differences between CLCC, CQFP, and CBGA helps make an informed decision, as each package offers unique features for various needs, from high-density connections to thermal perform

2026-03-13

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   Whatsapp:+86 18916250130
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