Main feature:
Insulation material: 92~95%Al2O3
Heat sink: WCu15/WCu12/Mo85Cu15/Mo60Cu40
Flatness: ≤0.10mm
Plating: Ni/Au, Ni/Au Ni/Au/, partially Au platedAvailability: | |
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Quantity: | |
Technical peremeter
Hermeticity | Helium R1≤1×10-3Pa∙cm3/s |
Plating options | Ni:1.3~8.9µm/2.54~11.3µm Au:0.3~0.9µm/1.3~5.7µm |
Insulation resistance | ≤1×1010Ω, DC500V |
High and low temperature cycle | -65~+175℃, 500 cycles |
Thermal shock | -65~150℃, 15 cycles |
Mechanical shock | Mechanical shock 1500g, Sweep frequency vibration 20g, Constant acceleration 20000g |
Salt fog | 24 hr |
SMD are ideally welded form thermally conductive electrodes,dedigned with metal housing and ceramic base, small and lightweight.
Advantages:
The volume and weight of SMD components are only about 1/10 of traditional plug-in components.
High reliability, strong shock resistance, low solder joint defect rate.
Good high-frequency characteristics, reducing electromagnetic and radio frequency interference.
Easy to implement automation, improve production efficiency, reduce costs in the areas of materials, energy, equipment, labor and time.
Technical peremeter
Hermeticity | Helium R1≤1×10-3Pa∙cm3/s |
Plating options | Ni:1.3~8.9µm/2.54~11.3µm Au:0.3~0.9µm/1.3~5.7µm |
Insulation resistance | ≤1×1010Ω, DC500V |
High and low temperature cycle | -65~+175℃, 500 cycles |
Thermal shock | -65~150℃, 15 cycles |
Mechanical shock | Mechanical shock 1500g, Sweep frequency vibration 20g, Constant acceleration 20000g |
Salt fog | 24 hr |
SMD are ideally welded form thermally conductive electrodes,dedigned with metal housing and ceramic base, small and lightweight.
Advantages:
The volume and weight of SMD components are only about 1/10 of traditional plug-in components.
High reliability, strong shock resistance, low solder joint defect rate.
Good high-frequency characteristics, reducing electromagnetic and radio frequency interference.
Easy to implement automation, improve production efficiency, reduce costs in the areas of materials, energy, equipment, labor and time.
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