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TO Packages

Transistor Outline (TO) packages consist of two parts: the TO header and the TO cap. We offer various standard TO connector shapes and sizes such as TO5, TO9, TO18, TO38, TO39, TO46, TO56, TO60 and TO65.Additionally, our R&D team can collaborate with clients to develop customized solutions.
 

TO Test Parameters:

Hermeticity

Leak rate is ≤1×10-3 Pa·cm 3/s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

Bending Resistance Test

Leads are bent to 90°, 3mm from substrate

Tensile Strength Test

1.5Kg weight is connected to lead for 30 seconds

Solderability Test

 Lead-free tin heated to 245 ℃±5 ℃ with KS-C-5W flux; immersion time 3 seconds

Pure Water Test

Immersion in deionized water at 25℃±5℃ for 24 hours

Availability:
Quantity:

TO packages are essential for installing various optical and electronic components, from basic circuits to semiconductors. Leads extend from the housing, delivering power to sealed components. Core component performance, like photo and laser diodes, is critical, as environmental factors can cause corrosion, leading to component failure. Leveraging our extensive expertise in hermeticity, Jitai employs encapsulation techniques to safeguard sealed components, ensuring prolonged functionality within microelectronic packages.


TO Packages

Parts

TO Header/TO Cap

Header Structures

Shelled/Stamped

Cap Structures

Lens Caps/ Window Caps

Base

Kovar/Alloy52/Alloy42/CRS

Pins

Kovar

Insulator

BH-A/K

Solder Ring

HLAgcu28


TO46 Series

china to package best to package to package for sale

Base

Pins

Insulator

Solder Ring

Plating

Insulation Resistance

Hermeticity

4J42 4J29

BH-A/K

HLAgCu28

Ni 3~8.9μm, Au≥0.3μm

500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω

Leak rate is ≤1×10-3 Pa·cm 3/s

4J42 4J29

BH-A/K

HLAgCu28

Ni 3~8μm, Au≥0.3μm

4J29 4J29

BH-A/K

HLAgCu28

Ni 2~8.9μm, Au≥0.3μm

4J29 4J29

BH-A/K

HLAgCu28

Ni 3~8.9μm, Au≥0.3μm

4J29 4J29

BH-A/K

HLAgCu28

Ni 1.3~8.9μm, Au≥0.7μm

Additional TO series; specs available upon request

TO60 Series TO60-7 pin MWDM

TO60-8 pin

TO60-7 pin

TO60 double columned

   

TO 38
TO65 TO65-6 pin
TO 9 Series TO9-1

TO9-2


TO39 Series TO39 (2+1) nail head

TO39 (2+1)

TO39 (1+1)


TO5 Series TO5 (7+1)

TO5 (5+1)

TO5 (3+1)

TO5 (2+1)

TO5 (2+1) 2.0T

TO5-4pin

TO5 (3*4)

TO5 (1.9*1.9)

TO5 (4.9*4.9)

TO5 sided window
TO56 Series TO56-7 pin

TO56-7 pin MWDM

TO56-7 pin EML

TO56-7 pin (25G)

TO56-7 pin TEC

TO56-5 pin

TO56-5 pin(25G)

TO56-5 pin(25G) with heat sink

TO56-6 pin (25G)

TO56 (650nm)

TO56(808nm)

TO56 (2.5G)

TO56-7 pin double columned

TO56 flat


TO18 Series TO18 (3+1)

TO18 (2+1)

TO18 (1+1)

TO18 (2+1) half circle

TO18-2 pin


Additional designs. We manufacture thousands of models; if you do not see what you are looking for please contact us


Description: glass to metal seal, circular package, 3+1 kovar nail head leads, Alloy 42 housing, Au finishing.

MBCY006-w3c



Housing

Cap

Leads

Insulators

86ba82b0ev4a599431fd425b8eb1b631

Materials

4J42

Kovar

BH-A/K

Plating

Ni: 2~11.4μm, Au≥1μm

Ni: 2~11.4μm

Ni: 2~11.4μm, Au≥1.3μm

Dimension

Housing:Φ5.31mm+0.2, Cap: H:3.1mm±0.1

Insulation resistance

≥ 1× 1010 Ω (500V DC)

Hermeticity

≥  1x 10-3  Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description: glass to metal seal, circular package, 2+1 kovar leads, SPCC housing, Au finishing.

MBCY009-w3d



Housing

Leads

Insulators

635099d8ah4d855bebba48fcd153fdd4

Materials

SPCC

Kovar

BH-G/K

Plating

Ni: 3~11.43μm, Au≥0.8μm

Diameter

Φ9.4±0.1

Insulation resistance

≥ 1× 109 Ω (500V DC)

Hermeticity

≤  1x 10-3  Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description: glass to metal seal, circular package, 3+1 kovar leads, SPCC housing, Au finishing.

MBCY009-w4i



Housing

Leads

Insulators

   87bd691ccjdbbd9ba4de6df0118b5715

Materials

SPCC

Kovar

BH-G/K

Plating

Ni: 3~8.9μm, Au≥0.03μm

Diameter

Φ9.15mm±0.1

Insulation resistance

≥ 1× 1010 Ω (500V DC)

Hermeticity

≤  2 x 10-3  Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description: glass to metal seal, circular Kovar package, nail head leads, Au finishing.

MBCY013-p6



Housing

Leads

Insulators

af71c36d0nb4565880394e9632804fd7

Materials

Kovar

DM-305

Plating

Ni: 1.3~11.43μm, Au≥1.3μm

Diameter

Φ12.7mm±0.1

Insulation resistance

≥ 1× 1010 Ω (500V DC)

Hermeticity

≤  1 x 10-3  Pa * cm3 /s

Note

Unspecified tolerances are ±0.1mm


Description: glass to metal seal, TO package , Alloy 42 housing, 4 Kovar leads, Au finishing.

TO-46-073



Base

Leads

Insulator

                 7ae0d7210h2fa24c9eecf3d96ca797d3

Materials  

4J42

4J29

BH-A/K

Plating

Ni:3~8.9μm, Au:≥0.8μm

Insulation resistance

≥1× 1010Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.1mm


Description: glass to metal seal, TO package , Alloy 42 , 2+1 Kovar leads, Au finishing.

TO-46-063



Base

Leads

Insulator

cc86b2944hc40196e4ec0d7c4e801ed5

Materials  

4J42

4J29

BH-A/K

Plating

Ni:3~8.9μm, Au:≥0.3μm

Insulation resistance

≥1× 1010Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s


Description: glass to metal seal, TO package , Alloy 42 housing, 2+1 Kovar leads, Au finishing.


TO-46-058



Base

Leads

Insulator

e1791b3d0ned56c405023fdc368b2026

fbe998f29g9a0de0b6d4409505d489a5

Materials  

4J42

4J29

BH-A/K

Plating

Ni:2~8.9μm, Au:≥0.3μm

Insulation resistance

≥1× 1010Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s


Description: glass to metal seal, TO package , SPCC housing, 3+1 nailhead leads, Au finishing.

TO-46-049



Base

Leads

Insulator

b73e193d3kbce25a083f28e9d3deb660

Materials  

SPCC

4J29

BH-A/K

Plating

Ni:3~8.9μm, Au:>0.03μm

Hermeticity  

≤  2 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.1mm


Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.

TO-46-041



Base

Leads

Insulator

Solder ring

8d8b5a9efof4ede0cc01e96e42f099c2

Materials  

4J29

4J29

BH-A/K

HLAgCu28

Plating

Ni:1.3~8.9μm, Au:≥0.3μm

Insulation resistance

≥1× 109Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.02mm


Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.

TO-46-029



Base

Leads

Insulator

e26500c93r1bc2e719a8768a166d4c54

Materials  

4J29

4J29

BH-A/K

Plating

Ni:1.3~8.9μm, Au:≥0.7μm

Insulation resistance

≥1× 1010Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.15mm


Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.

TO-46-025



Base

Leads

Insulator

d20840898m7a0f1923744be30c527988

Materials  

4J29

4J29

BH-A/K

Plating

Option 1:Ni:2.5~8.9μm, Au:≥0.7μm;

Option 2:Ni:1.3~8.9μm, Au:≥0.5μm;

Insulation resistance

≥1× 1010Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s


Description: glass to metal seal, TO package , Alloy 42 housing, 4 kovar leads, Au finishing.


TO-46-016-0.25



Base

Leads

Insulator

7e3287e5fo2c020bbbe199c19118b742

Materials  

4J42

4J29

BH-A/K

Plating

Ni:1.3~8.9μm, Au:≥0.3μm

Insulation resistance

≥1× 1010Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.


TO-46-016



Base

Leads

Insulator

Solder ring

7e3287e5fo2c020bbbe199c19118b742

944a602fdibfef0ff961c51338e1c4b2

Materials  

4J29

4J29

BH-A/K

HLAgCu28

Plating

Ni:2.5~11.43μm, Au:≥0.7μm

Diameter

Φ9.14mm+0.06-0.1mm

Insulation resistance

≥1× 109Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.

TO-46-006



Base

Leads

Insulator

Solder ring

ef06f8eebg576738f4093d8c4b5dcd48

Materials  

4J29

4J29

DM-305

HLAgCu28

Plating

Ni:1.3~8.9μm, Au:≥0.7μm

Insulation resistance

≥1× 109Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description: glass to metal seal, TO package , Kovar housing, 4 kovar leads, Au finishing.


TO-39-013



Base

Leads

5a6452743q923460be87cf59fa5a7efd

Materials  

4J29

4J29

Plating

Ni:2.5~11.43μm, Au:≥0.7μm

Diameter

Φ9.14mm+0.06-0.1mm

Insulation resistance

≥1× 109Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified  tolerances per GB/T 1804-m



QUALITY CONTROL


Over the years, we have perfected our multi-step process to ensure that each component passes rigorous quality and functionality tests, starting from the initial stages before raw materials are even acquired. Upon arrival, raw materials undergo an acceptance sampling method to determine acceptance. If accepted, the entire shipment is thoroughly cleaned, inspected, and any minor imperfections are addressed before warehousing. Following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, adjusted to meet our clients' stringent air tightness requirements. Subsequently, after the plating stage, each batch undergoes sampling inspection and coating bonding degree analysis. Products passing this stage then undergo a comprehensive inspection, evaluating appearance, construction, plating thickness, and a second hermeticity test. Furthermore, they undergo a series of Factory Inspection trials, including pin fatigue tests, salt spray corrosion resistance tests, and climate simulation equipment analysis for performance assessment. Approved products are individually vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery, reflecting our commitment to maintaining product integrity from our factory to your hands.




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