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TO Packages

Transistor Outline (TO) packages consist of two parts: the TO header and the TO cap. We offer various standard TO connector shapes and sizes such as TO5, TO9, TO18, TO38, TO39, TO46, TO56, TO60 and TO65.Additionally, our R&D team can collaborate with clients to develop customized solutions.
 

TO Test Parameters:

Hermeticity

Leak rate is ≤1×10-3 Pa·cm 3/s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

Bending Resistance Test

Leads are bent to 90°, 3mm from substrate

Tensile Strength Test

1.5Kg weight is connected to lead for 30 seconds

Solderability Test

 Lead-free tin heated to 245 ℃±5 ℃ with KS-C-5W flux; immersion time 3 seconds

Pure Water Test

Immersion in deionized water at 25℃±5℃ for 24 hours

Availability:

TO packages are essential for installing various optical and electronic components, from basic circuits to semiconductors. Leads extend from the housing, delivering power to sealed components. Core component performance, like photo and laser diodes, is critical, as environmental factors can cause corrosion, leading to component failure. Leveraging our extensive expertise in hermeticity, Jitai employs encapsulation techniques to safeguard sealed components, ensuring prolonged functionality within microelectronic packages.


TO Packages

Parts

TO Header/TO Cap

Header Structures

Shelled/Stamped

Cap Structures

Lens Caps/ Window Caps

Base

Kovar/Alloy52/Alloy42/CRS

Pins

Kovar

Insulator

BH-A/K

Solder Ring

HLAgcu28


TO46 Series

china to package best to package to package for sale

Base

Pins

Insulator

Solder Ring

Plating

Insulation Resistance

Hermeticity

4J42 4J29

BH-A/K

HLAgCu28

Ni 3~8.9μm, Au≥0.3μm

500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω

Leak rate is ≤1×10-3 Pa·cm 3/s

4J42 4J29

BH-A/K

HLAgCu28

Ni 3~8μm, Au≥0.3μm

4J29 4J29

BH-A/K

HLAgCu28

Ni 2~8.9μm, Au≥0.3μm

4J29 4J29

BH-A/K

HLAgCu28

Ni 3~8.9μm, Au≥0.3μm

4J29 4J29

BH-A/K

HLAgCu28

Ni 1.3~8.9μm, Au≥0.7μm

Additional TO series; specs available upon request

TO60 Series TO60-7 pin MWDM

TO60-8 pin

TO60-7 pin

TO60 double columned

   

TO 38
TO65 TO65-6 pin
TO 9 Series TO9-1

TO9-2


TO39 Series TO39 (2+1) nail head

TO39 (2+1)

TO39 (1+1)


TO5 Series TO5 (7+1)

TO5 (5+1)

TO5 (3+1)

TO5 (2+1)

TO5 (2+1) 2.0T

TO5-4pin

TO5 (3*4)

TO5 (1.9*1.9)

TO5 (4.9*4.9)

TO5 sided window
TO56 Series TO56-7 pin

TO56-7 pin MWDM

TO56-7 pin EML

TO56-7 pin (25G)

TO56-7 pin TEC

TO56-5 pin

TO56-5 pin(25G)

TO56-5 pin(25G) with heat sink

TO56-6 pin (25G)

TO56 (650nm)

TO56(808nm)

TO56 (2.5G)

TO56-7 pin double columned

TO56 flat


TO18 Series TO18 (3+1)

TO18 (2+1)

TO18 (1+1)

TO18 (2+1) half circle

TO18-2 pin



QUALITY CONTROL


Over the years, we have perfected our multi-step process to ensure that each component passes rigorous quality and functionality tests, starting from the initial stages before raw materials are even acquired. Upon arrival, raw materials undergo an acceptance sampling method to determine acceptance. If accepted, the entire shipment is thoroughly cleaned, inspected, and any minor imperfections are addressed before warehousing. Following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, adjusted to meet our clients' stringent air tightness requirements. Subsequently, after the plating stage, each batch undergoes sampling inspection and coating bonding degree analysis. Products passing this stage then undergo a comprehensive inspection, evaluating appearance, construction, plating thickness, and a second hermeticity test. Furthermore, they undergo a series of Factory Inspection trials, including pin fatigue tests, salt spray corrosion resistance tests, and climate simulation equipment analysis for performance assessment. Approved products are individually vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery, reflecting our commitment to maintaining product integrity from our factory to your hands.




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