TO Test Parameters:
Hermeticity | Leak rate is ≤1×10-3 Pa·cm 3/s |
Insulation Resistance | ≥1× 1010 Ω (500V DC) glass |
Bending Resistance Test | Leads are bent to 90°, 3mm from substrate |
Tensile Strength Test | 1.5Kg weight is connected to lead for 30 seconds |
Solderability Test | Lead-free tin heated to 245 ℃±5 ℃ with KS-C-5W flux; immersion time 3 seconds |
Pure Water Test | Immersion in deionized water at 25℃±5℃ for 24 hours |
Availability: | |
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Quantity: | |
TO packages are essential for installing various optical and electronic components, from basic circuits to semiconductors. Leads extend from the housing, delivering power to sealed components. Core component performance, like photo and laser diodes, is critical, as environmental factors can cause corrosion, leading to component failure. Leveraging our extensive expertise in hermeticity, Jitai employs encapsulation techniques to safeguard sealed components, ensuring prolonged functionality within microelectronic packages.
TO Packages | |
Parts | TO Header/TO Cap |
Header Structures | Shelled/Stamped |
Cap Structures | Lens Caps/ Window Caps |
Base | Kovar/Alloy52/Alloy42/CRS |
Pins | Kovar |
Insulator | BH-A/K |
Solder Ring | HLAgcu28 |
TO46 Series | ||||||
![]() | ![]() | ![]() | ||||
Base | Pins | Insulator | Solder Ring | Plating | Insulation Resistance | Hermeticity |
4J42 | 4J29 | BH-A/K | HLAgCu28 | Ni 3~8.9μm, Au≥0.3μm | 500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω | Leak rate is ≤1×10-3 Pa·cm 3/s |
4J42 | 4J29 | BH-A/K | HLAgCu28 | Ni 3~8μm, Au≥0.3μm | ||
4J29 | 4J29 | BH-A/K | HLAgCu28 | Ni 2~8.9μm, Au≥0.3μm | ||
4J29 | 4J29 | BH-A/K | HLAgCu28 | Ni 3~8.9μm, Au≥0.3μm | ||
4J29 | 4J29 | BH-A/K | HLAgCu28 | Ni 1.3~8.9μm, Au≥0.7μm |
TO60 Series | TO60-7 pin MWDM |
TO60-8 pin | |
TO60-7 pin | |
TO60 double columned |
TO 38 | |
TO65 | TO65-6 pin |
TO 9 Series | TO9-1 |
TO9-2 |
TO39 Series | TO39 (2+1) nail head |
TO39 (2+1) | |
TO39 (1+1) |
TO5 Series | TO5 (7+1) |
TO5 (5+1) | |
TO5 (3+1) | |
TO5 (2+1) | |
TO5 (2+1) 2.0T | |
TO5-4pin | |
TO5 (3*4) | |
TO5 (1.9*1.9) | |
TO5 (4.9*4.9) | |
TO5 sided window |
TO56 Series | TO56-7 pin |
TO56-7 pin MWDM | |
TO56-7 pin EML | |
TO56-7 pin (25G) | |
TO56-7 pin TEC | |
TO56-5 pin | |
TO56-5 pin(25G) | |
TO56-5 pin(25G) with heat sink | |
TO56-6 pin (25G) | |
TO56 (650nm) | |
TO56(808nm) | |
TO56 (2.5G) | |
TO56-7 pin double columned | |
TO56 flat |
TO18 Series | TO18 (3+1) |
TO18 (2+1) | |
TO18 (1+1) | |
TO18 (2+1) half circle | |
TO18-2 pin |
Additional designs. We manufacture thousands of models; if you do not see what you are looking for please contact us
Description: glass to metal seal, circular package, 3+1 kovar nail head leads, Alloy 42 housing, Au finishing.
MBCY006-w3c | |||||
Housing | Cap | Leads | Insulators | ![]() | |
Materials | 4J42 | Kovar | BH-A/K | ||
Plating | Ni: 2~11.4μm, Au≥1μm | Ni: 2~11.4μm | Ni: 2~11.4μm, Au≥1.3μm | ||
Dimension | Housing:Φ5.31mm+0.2, Cap: H:3.1mm±0.1 | ||||
Insulation resistance | ≥ 1× 1010 Ω (500V DC) | ||||
Hermeticity | ≥ 1x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, circular package, 2+1 kovar leads, SPCC housing, Au finishing.
MBCY009-w3d | ||||
Housing | Leads | Insulators | ![]() | |
Materials | SPCC | Kovar | BH-G/K | |
Plating | Ni: 3~11.43μm, Au≥0.8μm | |||
Diameter | Φ9.4±0.1 | |||
Insulation resistance | ≥ 1× 109 Ω (500V DC) | |||
Hermeticity | ≤ 1x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, circular package, 3+1 kovar leads, SPCC housing, Au finishing.
MBCY009-w4i | ||||
Housing | Leads | Insulators | ![]() | |
Materials | SPCC | Kovar | BH-G/K | |
Plating | Ni: 3~8.9μm, Au≥0.03μm | |||
Diameter | Φ9.15mm±0.1 | |||
Insulation resistance | ≥ 1× 1010 Ω (500V DC) | |||
Hermeticity | ≤ 2 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, circular Kovar package, nail head leads, Au finishing.
MBCY013-p6 | ||||
Housing | Leads | Insulators | ![]() | |
Materials | Kovar | DM-305 | ||
Plating | Ni: 1.3~11.43μm, Au≥1.3μm | |||
Diameter | Φ12.7mm±0.1 | |||
Insulation resistance | ≥ 1× 1010 Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.1mm |
Description: glass to metal seal, TO package , Alloy 42 housing, 4 Kovar leads, Au finishing.
TO-46-073 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J42 | 4J29 | BH-A/K | |
Plating | Ni:3~8.9μm, Au:≥0.8μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.1mm |
Description: glass to metal seal, TO package , Alloy 42 , 2+1 Kovar leads, Au finishing.
TO-46-063 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J42 | 4J29 | BH-A/K | |
Plating | Ni:3~8.9μm, Au:≥0.3μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s |
Description: glass to metal seal, TO package , Alloy 42 housing, 2+1 Kovar leads, Au finishing.
TO-46-058 | ||||
Base | Leads | Insulator | ||
Materials | 4J42 | 4J29 | BH-A/K | |
Plating | Ni:2~8.9μm, Au:≥0.3μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s |
Description: glass to metal seal, TO package , SPCC housing, 3+1 nailhead leads, Au finishing.
TO-46-049 | ||||
Base | Leads | Insulator | ![]() | |
Materials | SPCC | 4J29 | BH-A/K | |
Plating | Ni:3~8.9μm, Au:>0.03μm | |||
Hermeticity | ≤ 2 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.1mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-041 | |||||
Base | Leads | Insulator | Solder ring | ![]() | |
Materials | 4J29 | 4J29 | BH-A/K | HLAgCu28 | |
Plating | Ni:1.3~8.9μm, Au:≥0.3μm | ||||
Insulation resistance | ≥1× 109Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.02mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-029 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J29 | 4J29 | BH-A/K | |
Plating | Ni:1.3~8.9μm, Au:≥0.7μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.15mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-025 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J29 | 4J29 | BH-A/K | |
Plating | Option 1:Ni:2.5~8.9μm, Au:≥0.7μm; | |||
Option 2:Ni:1.3~8.9μm, Au:≥0.5μm; | ||||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s |
Description: glass to metal seal, TO package , Alloy 42 housing, 4 kovar leads, Au finishing.
TO-46-016-0.25 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J42 | 4J29 | BH-A/K | |
Plating | Ni:1.3~8.9μm, Au:≥0.3μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-016 | |||||
Base | Leads | Insulator | Solder ring | ||
Materials | 4J29 | 4J29 | BH-A/K | HLAgCu28 | |
Plating | Ni:2.5~11.43μm, Au:≥0.7μm | ||||
Diameter | Φ9.14mm+0.06-0.1mm | ||||
Insulation resistance | ≥1× 109Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-006 | |||||
Base | Leads | Insulator | Solder ring | ![]() | |
Materials | 4J29 | 4J29 | DM-305 | HLAgCu28 | |
Plating | Ni:1.3~8.9μm, Au:≥0.7μm | ||||
Insulation resistance | ≥1× 109Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, TO package , Kovar housing, 4 kovar leads, Au finishing.
TO-39-013 | |||
Base | Leads | ![]() | |
Materials | 4J29 | 4J29 | |
Plating | Ni:2.5~11.43μm, Au:≥0.7μm | ||
Diameter | Φ9.14mm+0.06-0.1mm | ||
Insulation resistance | ≥1× 109Ω (500V DC) | ||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||
Note | Unspecified tolerances per GB/T 1804-m |
QUALITY CONTROL
Over the years, we have perfected our multi-step process to ensure that each component passes rigorous quality and functionality tests, starting from the initial stages before raw materials are even acquired. Upon arrival, raw materials undergo an acceptance sampling method to determine acceptance. If accepted, the entire shipment is thoroughly cleaned, inspected, and any minor imperfections are addressed before warehousing. Following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, adjusted to meet our clients' stringent air tightness requirements. Subsequently, after the plating stage, each batch undergoes sampling inspection and coating bonding degree analysis. Products passing this stage then undergo a comprehensive inspection, evaluating appearance, construction, plating thickness, and a second hermeticity test. Furthermore, they undergo a series of Factory Inspection trials, including pin fatigue tests, salt spray corrosion resistance tests, and climate simulation equipment analysis for performance assessment. Approved products are individually vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery, reflecting our commitment to maintaining product integrity from our factory to your hands.
TO packages are essential for installing various optical and electronic components, from basic circuits to semiconductors. Leads extend from the housing, delivering power to sealed components. Core component performance, like photo and laser diodes, is critical, as environmental factors can cause corrosion, leading to component failure. Leveraging our extensive expertise in hermeticity, Jitai employs encapsulation techniques to safeguard sealed components, ensuring prolonged functionality within microelectronic packages.
TO Packages | |
Parts | TO Header/TO Cap |
Header Structures | Shelled/Stamped |
Cap Structures | Lens Caps/ Window Caps |
Base | Kovar/Alloy52/Alloy42/CRS |
Pins | Kovar |
Insulator | BH-A/K |
Solder Ring | HLAgcu28 |
TO46 Series | ||||||
![]() | ![]() | ![]() | ||||
Base | Pins | Insulator | Solder Ring | Plating | Insulation Resistance | Hermeticity |
4J42 | 4J29 | BH-A/K | HLAgCu28 | Ni 3~8.9μm, Au≥0.3μm | 500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω | Leak rate is ≤1×10-3 Pa·cm 3/s |
4J42 | 4J29 | BH-A/K | HLAgCu28 | Ni 3~8μm, Au≥0.3μm | ||
4J29 | 4J29 | BH-A/K | HLAgCu28 | Ni 2~8.9μm, Au≥0.3μm | ||
4J29 | 4J29 | BH-A/K | HLAgCu28 | Ni 3~8.9μm, Au≥0.3μm | ||
4J29 | 4J29 | BH-A/K | HLAgCu28 | Ni 1.3~8.9μm, Au≥0.7μm |
TO60 Series | TO60-7 pin MWDM |
TO60-8 pin | |
TO60-7 pin | |
TO60 double columned |
TO 38 | |
TO65 | TO65-6 pin |
TO 9 Series | TO9-1 |
TO9-2 |
TO39 Series | TO39 (2+1) nail head |
TO39 (2+1) | |
TO39 (1+1) |
TO5 Series | TO5 (7+1) |
TO5 (5+1) | |
TO5 (3+1) | |
TO5 (2+1) | |
TO5 (2+1) 2.0T | |
TO5-4pin | |
TO5 (3*4) | |
TO5 (1.9*1.9) | |
TO5 (4.9*4.9) | |
TO5 sided window |
TO56 Series | TO56-7 pin |
TO56-7 pin MWDM | |
TO56-7 pin EML | |
TO56-7 pin (25G) | |
TO56-7 pin TEC | |
TO56-5 pin | |
TO56-5 pin(25G) | |
TO56-5 pin(25G) with heat sink | |
TO56-6 pin (25G) | |
TO56 (650nm) | |
TO56(808nm) | |
TO56 (2.5G) | |
TO56-7 pin double columned | |
TO56 flat |
TO18 Series | TO18 (3+1) |
TO18 (2+1) | |
TO18 (1+1) | |
TO18 (2+1) half circle | |
TO18-2 pin |
Additional designs. We manufacture thousands of models; if you do not see what you are looking for please contact us
Description: glass to metal seal, circular package, 3+1 kovar nail head leads, Alloy 42 housing, Au finishing.
MBCY006-w3c | |||||
Housing | Cap | Leads | Insulators | ![]() | |
Materials | 4J42 | Kovar | BH-A/K | ||
Plating | Ni: 2~11.4μm, Au≥1μm | Ni: 2~11.4μm | Ni: 2~11.4μm, Au≥1.3μm | ||
Dimension | Housing:Φ5.31mm+0.2, Cap: H:3.1mm±0.1 | ||||
Insulation resistance | ≥ 1× 1010 Ω (500V DC) | ||||
Hermeticity | ≥ 1x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, circular package, 2+1 kovar leads, SPCC housing, Au finishing.
MBCY009-w3d | ||||
Housing | Leads | Insulators | ![]() | |
Materials | SPCC | Kovar | BH-G/K | |
Plating | Ni: 3~11.43μm, Au≥0.8μm | |||
Diameter | Φ9.4±0.1 | |||
Insulation resistance | ≥ 1× 109 Ω (500V DC) | |||
Hermeticity | ≤ 1x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, circular package, 3+1 kovar leads, SPCC housing, Au finishing.
MBCY009-w4i | ||||
Housing | Leads | Insulators | ![]() | |
Materials | SPCC | Kovar | BH-G/K | |
Plating | Ni: 3~8.9μm, Au≥0.03μm | |||
Diameter | Φ9.15mm±0.1 | |||
Insulation resistance | ≥ 1× 1010 Ω (500V DC) | |||
Hermeticity | ≤ 2 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, circular Kovar package, nail head leads, Au finishing.
MBCY013-p6 | ||||
Housing | Leads | Insulators | ![]() | |
Materials | Kovar | DM-305 | ||
Plating | Ni: 1.3~11.43μm, Au≥1.3μm | |||
Diameter | Φ12.7mm±0.1 | |||
Insulation resistance | ≥ 1× 1010 Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.1mm |
Description: glass to metal seal, TO package , Alloy 42 housing, 4 Kovar leads, Au finishing.
TO-46-073 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J42 | 4J29 | BH-A/K | |
Plating | Ni:3~8.9μm, Au:≥0.8μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.1mm |
Description: glass to metal seal, TO package , Alloy 42 , 2+1 Kovar leads, Au finishing.
TO-46-063 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J42 | 4J29 | BH-A/K | |
Plating | Ni:3~8.9μm, Au:≥0.3μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s |
Description: glass to metal seal, TO package , Alloy 42 housing, 2+1 Kovar leads, Au finishing.
TO-46-058 | ||||
Base | Leads | Insulator | ||
Materials | 4J42 | 4J29 | BH-A/K | |
Plating | Ni:2~8.9μm, Au:≥0.3μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s |
Description: glass to metal seal, TO package , SPCC housing, 3+1 nailhead leads, Au finishing.
TO-46-049 | ||||
Base | Leads | Insulator | ![]() | |
Materials | SPCC | 4J29 | BH-A/K | |
Plating | Ni:3~8.9μm, Au:>0.03μm | |||
Hermeticity | ≤ 2 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.1mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-041 | |||||
Base | Leads | Insulator | Solder ring | ![]() | |
Materials | 4J29 | 4J29 | BH-A/K | HLAgCu28 | |
Plating | Ni:1.3~8.9μm, Au:≥0.3μm | ||||
Insulation resistance | ≥1× 109Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.02mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-029 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J29 | 4J29 | BH-A/K | |
Plating | Ni:1.3~8.9μm, Au:≥0.7μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.15mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-025 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J29 | 4J29 | BH-A/K | |
Plating | Option 1:Ni:2.5~8.9μm, Au:≥0.7μm; | |||
Option 2:Ni:1.3~8.9μm, Au:≥0.5μm; | ||||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s |
Description: glass to metal seal, TO package , Alloy 42 housing, 4 kovar leads, Au finishing.
TO-46-016-0.25 | ||||
Base | Leads | Insulator | ![]() | |
Materials | 4J42 | 4J29 | BH-A/K | |
Plating | Ni:1.3~8.9μm, Au:≥0.3μm | |||
Insulation resistance | ≥1× 1010Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-016 | |||||
Base | Leads | Insulator | Solder ring | ||
Materials | 4J29 | 4J29 | BH-A/K | HLAgCu28 | |
Plating | Ni:2.5~11.43μm, Au:≥0.7μm | ||||
Diameter | Φ9.14mm+0.06-0.1mm | ||||
Insulation resistance | ≥1× 109Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, TO package , Kovar housing, 2+1 Kovar leads, Au finishing.
TO-46-006 | |||||
Base | Leads | Insulator | Solder ring | ![]() | |
Materials | 4J29 | 4J29 | DM-305 | HLAgCu28 | |
Plating | Ni:1.3~8.9μm, Au:≥0.7μm | ||||
Insulation resistance | ≥1× 109Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, TO package , Kovar housing, 4 kovar leads, Au finishing.
TO-39-013 | |||
Base | Leads | ![]() | |
Materials | 4J29 | 4J29 | |
Plating | Ni:2.5~11.43μm, Au:≥0.7μm | ||
Diameter | Φ9.14mm+0.06-0.1mm | ||
Insulation resistance | ≥1× 109Ω (500V DC) | ||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||
Note | Unspecified tolerances per GB/T 1804-m |
QUALITY CONTROL
Over the years, we have perfected our multi-step process to ensure that each component passes rigorous quality and functionality tests, starting from the initial stages before raw materials are even acquired. Upon arrival, raw materials undergo an acceptance sampling method to determine acceptance. If accepted, the entire shipment is thoroughly cleaned, inspected, and any minor imperfections are addressed before warehousing. Following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, adjusted to meet our clients' stringent air tightness requirements. Subsequently, after the plating stage, each batch undergoes sampling inspection and coating bonding degree analysis. Products passing this stage then undergo a comprehensive inspection, evaluating appearance, construction, plating thickness, and a second hermeticity test. Furthermore, they undergo a series of Factory Inspection trials, including pin fatigue tests, salt spray corrosion resistance tests, and climate simulation equipment analysis for performance assessment. Approved products are individually vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery, reflecting our commitment to maintaining product integrity from our factory to your hands.
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