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English  |
Technical Parameters:
| Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s |
| Insulation Resistance | ≥1× 1010 Ω (500V DC) glass ≥1× 109 Ω (500V DC) ceramic |
| Salt Spray Test | 24h |
| Flatness | ≤ 0.05mm |
| Roughness | 0.8μm |
| Plating Quality Test | N2 450±10°C, 15 min |
| Temperature Cycling | -55°C to 125°C, 20 cycles |
| Thermal Shock | -55°C to 125°C, 20 cycles |
| Mechanical Shock | Condition B, Y1 Direction, 10,000g |
| Quantity: | |
|---|---|
Jitai specializes in crafting robust hermetic power packages tailored to a vast array of applications. Engineered for exceptional strength and reliability, these packages excel in demanding environments. It is mainly used in aerospace propulsion, power converters, motor drives, switching power supplies, power hybrid circuits and other scenarios that require efficient heat dissipation. Our offerings include glass-to-metal-seal (GTMS) and ceramic-to-metal-seal (CTMS) feedthroughs, ensuring comprehensive customization options to meet specific project needs.
Power Packages | ||
Structures | Machined | welded |
Materials | CRS/Stainless Steel | Frame:CRS/Stainless Steel Base:W85Cu15 MO50Cu50 Cu/Mo/Cu(1:1:1) Al50%-Si50% Oxygen Free Copper |
Leads | Copper cored Alloy50/Oxygen Free Copper /Alloy50 | |
Insulator | Glass/Ceramic | |
Solder Ring/Frame | HlAgCu28/HlAgCu8/Ag | |
MSFM3836-T13b | |||||
Parts | Housing | Pins | Insulator | Lid |
|
Materials | CRS | Copper Cored Kovar,Zirconium Copper | Al2O3 | Alloy42 | |
Pin Design | Single Row, Bent | ||||
Plating | Housing:Ni 4-14μm, Pins: Ni4-14, Au1.3-5.7μm Lid:Ni 3-11.43μm | ||||
Insulation Resistance | 500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω | ||||
Hermeticity | Leak rate is ≤1×10^-3 Pa·cm 3/s | ||||
MDFM7050-w20 | |||||
Parts | Base | Frame | Pins | Insulator |  |
Materials | Wu50Cu50 | CRS | Copper Cored Alloy52 | ELAN#13 | |
Pin Design | Flattened Bonding Tips | ||||
Plating | Housing:Ni 4-14μm, Pins: Ni4-14, Au≥1.3μm | ||||
Insulation Resistance | 500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω | ||||
Hermeticity | Leak rate is ≤1×10^-3 Pa·cm 3/s | ||||
Applicable Standards
Guiding Standard | ISO9001/GJB2440/GJB548/MIL883/JEDEC NO.9 |
Design and Reliability | GJB2440/GJB548/MIL883 |
Gold Plating | MIL-G-45204 |
Nickel Plating | QQ-N-290 |
Visual Inspection | JEDEC NO.9 |
QUALITY CONTROL
Throughout our evolution, we have refined a meticulous multi-step process to ensure each component surpasses stringent quality and functionality standards, commencing even before raw materials are acquired. Initially, incoming raw materials undergo an acceptance sampling method to determine acceptance. Accepted materials undergo thorough cleaning, full inspection, and minor imperfection rectification before warehousing. Subsequently, following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, employing a helium leak test tailored to client specifications. Post-plating, batches undergo sampling inspection and coating bonding degree analysis. Approved products undergo an extensive inspection process, meticulously assessing appearance, construction, plating thickness, and undergoing a secondary helium tracer gas hermeticity test. Subsequently, products undergo a range of Factory Inspection trials, including pin fatigue and salt spray corrosion resistance tests, alongside climate simulation analysis for performance evaluation. Approved products are then vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery.
Jitai specializes in crafting robust hermetic power packages tailored to a vast array of applications. Engineered for exceptional strength and reliability, these packages excel in demanding environments. It is mainly used in aerospace propulsion, power converters, motor drives, switching power supplies, power hybrid circuits and other scenarios that require efficient heat dissipation. Our offerings include glass-to-metal-seal (GTMS) and ceramic-to-metal-seal (CTMS) feedthroughs, ensuring comprehensive customization options to meet specific project needs.
Power Packages | ||
Structures | Machined | welded |
Materials | CRS/Stainless Steel | Frame:CRS/Stainless Steel Base:W85Cu15 MO50Cu50 Cu/Mo/Cu(1:1:1) Al50%-Si50% Oxygen Free Copper |
Leads | Copper cored Alloy50/Oxygen Free Copper /Alloy50 | |
Insulator | Glass/Ceramic | |
Solder Ring/Frame | HlAgCu28/HlAgCu8/Ag | |
MSFM3836-T13b | |||||
Parts | Housing | Pins | Insulator | Lid |
|
Materials | CRS | Copper Cored Kovar,Zirconium Copper | Al2O3 | Alloy42 | |
Pin Design | Single Row, Bent | ||||
Plating | Housing:Ni 4-14μm, Pins: Ni4-14, Au1.3-5.7μm Lid:Ni 3-11.43μm | ||||
Insulation Resistance | 500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω | ||||
Hermeticity | Leak rate is ≤1×10^-3 Pa·cm 3/s | ||||
MDFM7050-w20 | |||||
Parts | Base | Frame | Pins | Insulator | |
Materials | Wu50Cu50 | CRS | Copper Cored Alloy52 | ELAN#13 | |
Pin Design | Flattened Bonding Tips | ||||
Plating | Housing:Ni 4-14μm, Pins: Ni4-14, Au≥1.3μm | ||||
Insulation Resistance | 500V DC resistance between single glass sealed pin and base is ≥1×10^10 Ω | ||||
Hermeticity | Leak rate is ≤1×10^-3 Pa·cm 3/s | ||||
Applicable Standards
Guiding Standard | ISO9001/GJB2440/GJB548/MIL883/JEDEC NO.9 |
Design and Reliability | GJB2440/GJB548/MIL883 |
Gold Plating | MIL-G-45204 |
Nickel Plating | QQ-N-290 |
Visual Inspection | JEDEC NO.9 |
QUALITY CONTROL
Throughout our evolution, we have refined a meticulous multi-step process to ensure each component surpasses stringent quality and functionality standards, commencing even before raw materials are acquired. Initially, incoming raw materials undergo an acceptance sampling method to determine acceptance. Accepted materials undergo thorough cleaning, full inspection, and minor imperfection rectification before warehousing. Subsequently, following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, employing a helium leak test tailored to client specifications. Post-plating, batches undergo sampling inspection and coating bonding degree analysis. Approved products undergo an extensive inspection process, meticulously assessing appearance, construction, plating thickness, and undergoing a secondary helium tracer gas hermeticity test. Subsequently, products undergo a range of Factory Inspection trials, including pin fatigue and salt spray corrosion resistance tests, alongside climate simulation analysis for performance evaluation. Approved products are then vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery.
