Power Packages

Power packages are ideal for projects requiring effective thermal dissipation.Usually, Jitai utilizes computer numerical control milling (CNC milling) formachining the center of the housing. Nevertheless, our diverse range oftooling options empowers us to craft a broad aray of customized packagestailored to meet the specific requirements of virtually any project.

Technical Parameters:

Hermeticity	≤  1 x 10-3  Pa * cm3 /s
Insulation Resistance	≥1× 1010 Ω (500V DC) glass  ≥1× 109 Ω (500V DC) ceramic
Salt Spray Test	24h
Flatness	≤ 0.05mm
Roughness	0.8μm
Plating Quality Test	N2 450±10°C, 15 min
Temperature Cycling	-55°C to 125°C, 20 cycles
Thermal Shock	-55°C to 125°C, 20 cycles
Mechanical Shock	Condition B, Y1 Direction, 10,000g

Jitai specializes in crafting robust hermetic power packages tailored to a vast array of applications. Engineered for exceptional strength and reliability, these packages excel in demanding environments. It is mainly used in aerospace propulsion, power converters, motor drives, switching power supplies, power hybrid circuits and other scenarios that require efficient heat dissipation. Our offerings include glass-to-metal-seal (GTMS) and ceramic-to-metal-seal (CTMS) feedthroughs, ensuring comprehensive customization options to meet specific project needs.

Additional designs. We manufacture thousands of models; if you do not see what you are looking for please contact us.

Description: glass to metal seal, plug-in package, 7+1 copper cored Alloy 50 leads, #10 CRS housing, Au finishing on isolated leads.

M08086Q-006
	Base	Leads	Solder Ring
Materials	CRS#10	Copper cored 4J50	Ag72/Cu28
Plating	Ni:1.3～11.43μm	Ni: 1.3～11.43μm, Au: ≥1.3μm
Dimensions	L:27.31mm+0/-0.2  W:27.31mm+0/-0.2  H:6.7mm+0/-0.2
Insulation resistance	≥1× 109 Ω (500V DC)
Hermeticity	≤  1 x 10-3 Pa * cm3 /s
Note	Unspecified tolerances are ±0.2mm

Description: glass to metal seal, plug-in package, 45 copper cored Alloy 50 leads, #10 CRS housing, with flange, Au finishing on the leads.

MDFM4038-p45
	Housing	Leads	Insulators
Materials	#10 CRS	Copper cored 4J50	Elan #13
Plating	Ni: 1.3～11.43μm	Ni: 1.3～11.43μm; Au≥1.3μm
Dimensions	L:40.48mm W:37.8mm  H:4.75mm
Insulation resistance	≥1× 1010 Ω (500V DC)
Hermeticity	≤  1 x 10-3 Pa * cm3 /s
Note	Unspecified tolerances are ±0.2mm

Description: glass to metal seal, multi-piece structured butterfly package, 20 bent copper cored Alloy 50 leads with flattened wire bonding tips, Copper-tungsten base soldered to #10 CRS frame, Au finishing on the leads.

MDFM4333-w20
	Frame	Base	Leads	Insulators	Solder ring
Materials	#10 CRS	W50Cu50	Copper cored 4J50	Elan #13	HLAgCu28
Plating	Ni: 1.3～11.4μm		Ni: 1.3～11.4μm; Au≥1.3μm
Dimensions	L:43.18mm W:33.02mm  H:7.5mm
Insulation resistance	≥1× 1010 Ω (500V DC)
Hermeticity	≤  1 x 10-3 Pa * cm3 /s
Note	Unspecified tolerances are ±0.2mm

Description: glass to metal seal, Multi-piece package, 20 copper cored Alloy 50 leads with flattened wire bonding tips, Copper-tungsten base soldered to #10 CRS Frame, with flange, Au finishing on the leads.

MDFM7050-w20
	Frame	Base	Leads	Insulators
Materials	#10 CRS	W50Cu50	Copper cored 4J50	Elan #13
Plating	Ni: 4～14μm		Ni: 4～14μm; Au≥1.3μm
Dimensions	L:70-0.2mm W:50-0.2mm  H:9.5-0.2mm
Insulation resistance	≥1× 1010 Ω (500V DC)
Hermeticity	≤  1 x 10-3 Pa * cm3 /s
Note	Unspecified tolerances are ±0.2mm

Description: glass to metal seal,  bent multi-size leads, #10 CRS housing, with flange, Au finishing on the leads.

MDFM7941-t43g
	Housing	Leads Φ1	Lead Φ0.5	Insulators
Materials	#10 CRS	Copper cored 4J50	4J50	Elan #13
Plating	Ni: 3～15μm	Ni: 3～15μm; Au≥1.3μm
Dimensions	L:78.74mm W:40.64mm
Insulation resistance	≥1× 1010 Ω (500V DC)
Hermeticity	≤  1 x 10-3 Pa * cm3 /s
Salt Spray	24hr
Note	Unspecified tolerances are ±0.2mm

Description: glass to metal seal, plug-in package, 7+1 copper cored Alloy 50 leads, #10 CRS housing, Au finishing on isolated leads.

MDIP2727-p8d
	Housing	Leads	Insulators	Solder ring
Materials	#10 CRS	Copper cored 4J50	Elan #13	Ag72Cu28
Plating	Ni: 1.3～11.43μm	Ni: 1.3～11.43μm; Au≥1.3μm
Dimensions	L:27..23mm W:27.23mm  H:8.2mm
Insulation resistance	≥1× 1010 Ω (500V DC)
Hermeticity	≤  1 x 10-3 Pa * cm3 /s
Note	Unspecified tolerances are ±0.2mm

Description: Ceramic to metal seal, Multi-piece package, 3 copper cored Kovar leads with flattened wire bonding tips, Copper-tungsten base soldered to #10 CRS Frame, with isolator pad, heat sink and flange.

MSFM1111-w3e
	Base	Frame	Leads	Insulators	Isolator pad	Heat sink
Materials	W50Cu50	CRS	Copper cored Kovar	Ceramic	BeO	Mo
Plating	Ni: 1.3～11.43μm
Dimensions	L:10.6mm±0.2  W:10.6±0.2  H:4.8mm
Insulation resistance	≥1× 1010 Ω (500V DC)
Hermeticity	≤  1 x 10-3 Pa * cm3 /s
Note	Unspecified tolerances are ±0.2mm

Description: ceramic to metal seal, multi-piece structure, 3 copper cored Kovar leads with flattened wire bonding tips, copper-tungsten base solder to Kovar frame, with Isolator pad, heat sink and flange, Au finishing.

MSFM1414-w3c
	Base	Frame	Leads	Insulators	Isolator pad	Heat sink
Materials	W85Cu15	Kovar	Copper Cored Kovar	Ceramic	BeO	Mo
Plating	Ni: 1.3～11.43μm		Ni: 1.3～11.43μm Lead #1 Au ≥1.3μm, Lead#2,3 Au 0.2～0.6μm
Dimensions	L:13.7mm  W:13.7mm  H:6.55mm
Insulation resistance	≥1× 109 Ω (500V DC)
Hermeticity	≤  1 x 10-3  Pa * cm3 /s
Salt atmosphere	48 hr
Note	Unspecified tolerances are ±0.2mm

Description: glass to metal seal, multi-piece structure, 3 copper cored Kovar leads with flattened wire bonding tips, copper-tungsten base solder to Kovar frame, with Isolator pad, heat sink and flange.

MSFM1414-w3j
	Base	Frame	Leads	Insulators	Isolator pad	Heat sink
Materials	W85Cu15	Kovar	Copper Cored Kovar	Glass	BeO	Mo
Plating	Ni: 3～11.43μm		Ni: 3～11.43μm,             Au: ≥1.3μm
Dimensions	L:13.7mm  W:13.7mm  H:6.55mm
Insulation resistance	≥1× 109 Ω (500V DC)
Hermeticity	≤  1 x 10-3 Pa * cm3 /s
Note	Unspecified tolerances are ±0.2mm

Description: glass to metal seal, 3 bent leads with flattened wire bonding tips, #10 CRS housing, with  heat sink, Au finishing on the leads and outer wall of the housing.

MSFP1010-g5d
	Houseing	Leads	Heat Sink
Materials	CRS#10	4J50	W85Cu15
Plating	Interior wall： Ni: 3～11.43μm，Exterior wall: Ni: 3～11.43μm Au: ≥1.3μm	Interior lead：Ni: 3～11.43μm，Exterior lead : Ni: 3～11.43μm Au: ≥1.3μm
Dimensions	L:10.4mm W:10.3mm H:3.3mm
Insulation resistance	≥1× 1010 Ω (500V DC)
Hermeticity	≤  1 x 10-3 Pa * cm3 /s
Note	Unspecified tolerances are ±0.2mm

Applicable Standards

QUALITY CONTROL

Throughout our evolution, we have refined a meticulous multi-step process to ensure each component surpasses stringent quality and functionality standards, commencing even before raw materials are acquired. Initially, incoming raw materials undergo an acceptance sampling method to determine acceptance. Accepted materials undergo thorough cleaning, full inspection, and minor imperfection rectification before warehousing. Subsequently, following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, employing a helium leak test tailored to client specifications. Post-plating, batches undergo sampling inspection and coating bonding degree analysis. Approved products undergo an extensive inspection process, meticulously assessing appearance, construction, plating thickness, and undergoing a secondary helium tracer gas hermeticity test. Subsequently, products undergo a range of Factory Inspection trials, including pin fatigue and salt spray corrosion resistance tests, alongside climate simulation analysis for performance evaluation. Approved products are then vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery.