Gold-tin Preformed Lid

The preformed gold-tin lid is fixed on the ally or ceramic housing after it is accurately positioned and spot-welded. The preset gold tin lid solves the positioning problem that is prevalent in traditional methods, thus shortening the packaging process. This technique is widely used in the hermetic packaging of semiconductor devices. 

These lids have been widely used hybrid integrated circuits, semiconductor Integrated circuits, filter defies, micro wave devices, high -power devices, connectors and sensors.