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Opto-Electronic Packages

At Jitai, we aim to uphold structural integrity in demanding conditions while minimizing optical insertion loss in opto-electronic packages. Our range includes various shapes and sizes, each featuring multiple opto-channel design choices. We employ a range of forming and fabrication techniques tailored to specific production requirements.
 

Technical Parameters:

Hermeticity

≤  1 x 10-3  Pa * cm3 /s

Insulation Resistance

 ≥1× 1010 Ω (500V DC) glass

 ≥1× 109 Ω (500V DC) ceramic

Salt Spray Test

24h

Flatness

≤ 0.05mm

Roughness

0.8μm

Plating Quality Test

N450±10°C, 15 min

Temperature Cycling

-55°C to 125°C, 20 cycles

Thermal Shock

-55°C to 125°C, 20 cycles

Mechanical Shock

Condition B, Y1 Direction, 10,000g

Availability:
Quantity:

Appliations: Optical transmitters, optical detectors, optical modulators, amplifiers and high-power lasers. Widely used in automotive electronics, optical communications, medical equipments and public safety.


Jitai's optoelectronic product line encompasses two primary categories: sealed housings featuring an optical window or fiber, and TO products (refer to the TO header page for specifics). Our sealed optoelectronic housings, fabricated with glass-to-metal or ceramic-to-metal insulators, find diverse applications in commercial lasers, laser diodes, signal transmission, and medical devices. We offer extensive customization options for structural requirements and material combinations, along with recommendations from our catalog of open-tooling products, widely employed across various applications.


Structural Options

Material Combinations

Frame

Base

Leads

Insulator

Eyelet

Suitable

Applications

One Piece Machined

N/A

OFHC

Alloy52/Copper Cored Alloy52

Glass/Ceramic

CRS1010

Big-sized packages with output power less than 40W

N/A

Alumunium

Two-piece Soldered

CRS

OFHC

Alloy52/Copper Cored Alloy52

N/A

Small-sized packages with output power less than 40W

Stainless Steel

OFHC

Kovar

WCu

Copper Cored Kovar

Kovar

Kovar

Kovar


Additional designs. We manufacture thousands of models; if you do not see what you are looking for please contact us.


MDFO2113W14

Parts

Base

Frame

Solder Ring

Solder Frame

Leads

Insulator

Ferrule

Opto-Electronic-Packages

Materials

CRS

CRS

HLAgcu28

HLAgcu28

Kovar

BH-A/K/Elan #13 Zirconia Ceramic

Leads Design


Protrude from side

Plating


Housing:Ni 1.9~15.00μm,Au≥0.5μm;Leads:Ni1.9~8.00μm,Au≥0.5μm

Insulation Resistance


500V DC resistance between single glass sealed pin and base is ≥1×10^10Ω

Hermeticity


Leak rate is ≤1×10^-3 Pa·cm 3/s



MDFO1509W10



Parts


Base

Frame

Solder Ring

Solder Frame

Leads

Insulator

Tube

Ferrule

Opto-Electronic-Packages

Materials


W80Cu20

Kovar

HLAgcu28 HLAgcu28

Kovar

BH-A/K/Elan #13

CRS

Zirconia Ceramic

Leads Design


Protrude from side

Plating


Housing and Leads :Ni ≥1.9μm,Au≥0.5μm

Insulation Resistance


100V DC resistance between single glass sealed pin and base is ≥1×10^6 Ω

Hermeticity


Leak rate is ≤1×10^-3 Pa·cm 3/s


Description:  butterfly package, multi-piece structure, glass to metal seal, 6 leads with flattened wire bonding tips, copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.

MDFO0909-w6



Base

Frame

Tube

Leads

1d70e1ab6ifd8ce0e68a1be347959b3b

Materials  

W80Cu20

4J29

Plating

Ni: ≥2.5μm, Au: ≥0.6μm  

Dimensions  

L:17mm,W:10mm,H:7.3±0.25mm

Insulation resistance

≥1× 1010 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description:  8 leads with flattened wire bonding tips, copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.

MDFO1413-w8



Base

Frame

Leads

Tube

MDFO1413-w8

Materials  

W85Cu15

4J29

4J29

4J29

Plating

Ni:1.3~11.43μm, Au:≥0.7μm

Dimensions  

L:13.5mm  W:13.1mm  H:7.1mm±0.15

Lead current carrying capacity

≥1× 1010 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecifiedtolerances are ±0.2mm


Description: glass to metal seal, multi-piece structure, butterfly package, 16 rectangular shape leads , copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.

MDFO1413-w16b



Base  

Frame

Leads

MDFO1413-w16b

Materials  

W80Cu20

4J29

Plating

Ni:1.3~11.43μm, Au: 0.3μm  

Dimensions  

L:13.5mm,W:12.6mm,H:8mm

Insulation resistance

≥1× 1010 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description:  13+1 ground lead, Kovar plug-in package, with fiber optic channel, Au finishing.

MDFO2113-p14g



Housing

Leads

Tube

Insulator

Solder ring

MDFO2113-p14g

MDFO2113-p14g-1

Materials  

4J29

4J29

4J29

BH-G/K

HLAgCu28

Plating

Ni:2.5~8.9μm, Au: ≥0.75μm

Dimensions  

L:20.8mm,W:12.7mm,H:4.57mm

Insulation resistance

≥1× 1010 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description:  14 leads with flattened wire bonding tips, Kovar butterfly package, with flange and fiber optic channel, Au finishing.

MDFO3013-w14



Housing

Leads

MDFO3013-w14-2

Materials  

4J29

4J29

Plating

Ni:1.3~11.43μm, Au: ≥0.6μm

Ni: 1.3~11.43μm, Au: ≥1μm

Dimensions  

L:30mm±0.15,W:13mm±0.15  H:7.5mm±0.15

Insulation resistance

≥1× 1010 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.1mm


Description:  glass to metal seal, 28 leads Kovar package, with fiber optic channel and assembly eyelids, Au finishing.

MDFO6866-p28



Housing

Tube

Leads

Insulator

Solder ring

0c501b3bbsaf3d546df8adc7522284be

8b7bd8e5bm0f9a2e5bba2592e8c77c43 2

Materials  

4J29

DM308

HLAgCu28

Plating

Ni:1.3~8.9μm, Au: ≥1μm

Ni:1.3~8.9μm, Au: ≥1.3μm


Dimensions  

L:68mm,W:66mm,H:12.75mm

Insulation resistance

≥1× 1010 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description:  glass to metal seal, 54 leads Kovar package, with fiber optic channel and assembly eyelids, Au finishing.

MDFO6866-p54



Housing

Tube

Leads

Insulator

Solder ring

10d5d6352j4c8c2a835f54e95f58f7ac

Materials  

4J29

DM308

HLAgCu28

Plating

Ni:1.3~8.9μm, Au: ≥1μm

Ni:1.3~8.9μm, Au: ≥1.3μm


Dimensions  

L:68mm,W:66mm,H:12.75mm

Insulation resistance

≥1× 1010 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description:  glass to metal seal, high power opto-electronic package, 304 stainless steel housing,  4 bent alloy 50 leads, with assembly eyelid, flange and fiber optic channel, Au finishing.

MSFM9015-g4



Housing  

Tube

Leads

65c7b5966lb51b42939d5d202cf34c69 2

99391e0e3i8e843305bc435d5557ce0a 2

Materials  

304 stainless steel

4J50

Plating

Ni: 3~15μm, Au: ≥1μm  

Dimensions  

L:90mm,W:14.5mm,H:10mm

Insulation resistance

≥1× 109 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description: glass to metal seal, 6 leads with flattened wire bonding tips, Kovar package, with flange and fiber optic channel, Au finishing.

MSFO1710-w6



Housing

Tube

Leads

13f0327d0u3cb221a3ccb54dd0e12204

Materials  

4J29

Plating

Ni:1.3~11.43μm, Au: ≥0.5μm  

Dimensions  

L:17mm,W:10mm,H:7.3±0.25mm

Insulation resistance

≥1× 1010 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description:  2 leads, Kovar package, with triple fiber optic channels, Au finishing.

MSFO2006-p2



Housing

Leads

Tube

Insulator

Solder ring

5dfb37773ke4ae7528a1ba1b2092b66e

Materials  

4J29

4J29

4J29

BH-A/K

HLAgCu28

Plating

Ni:1.3~11.43μm, Au: ≥0.5μm

Dimensions  

L:20mm,W:5.6mm-0.1  H:4.4mm

Insulation resistance

≥1× 1010 Ω (500V DC)

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Note

Unspecified tolerances are ±0.2mm


Description:  6 leads, copper-tungsten base soldered to Kovar frame, with fiber optic channel, Au finishing.

MSFO6243-w6b



Base

Frame

Leads

Tube

Solder ring

Insulator

MSFO6243-w6b

Materials  

W85Cu15

4J29

4J29

4J29

HLAgCn28

DM-305

Plating

Ni:3~9μm, Au:0.05~0.25μm



Dimensions  

L:62mm±0.1  W:43mm±0.1  H:13.8mm±0.1

Lead current carrying capacity

At 2A constant current, it can withstand a pulse 4A current peak for 30 seconds

Hermeticity  

≤  1 x 10-3 Pa * cm3 /s

Solderiing

Solder spillage should not exceed 1mm from the edge

Note

Unspecifiedtolerances are ±0.2mm



Applicable Standards

Guiding Standard

ISO9001/GJB2440/GJB548/MIL883/JEDEC NO.9

Design and Reliability

GJB2440/GJB548/MIL883

Gold Plating

MIL-G-45204

Nickel Plating

QQ-N-290

Visual Inspection

JEDEC NO.9



QUALITY CONTROL


Throughout our evolution, we have refined a meticulous multi-step process to ensure each component surpasses stringent quality and functionality standards, commencing even before raw materials are acquired. Initially, incoming raw materials undergo an acceptance sampling method to determine acceptance. Accepted materials undergo thorough cleaning, full inspection, and minor imperfection rectification before warehousing. Subsequently, following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, employing a helium leak test tailored to client specifications. Post-plating, batches undergo sampling inspection and coating bonding degree analysis. Approved products undergo an extensive inspection process, meticulously assessing appearance, construction, plating thickness, and undergoing a secondary helium tracer gas hermeticity test. Subsequently, products undergo a range of Factory Inspection trials, including pin fatigue and salt spray corrosion resistance tests, alongside climate simulation analysis for performance evaluation. Approved products are then vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery.






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