Technical Parameters:
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s |
Insulation Resistance | ≥1× 1010 Ω (500V DC) glass ≥1× 109 Ω (500V DC) ceramic |
Salt Spray Test | 24h |
Flatness | ≤ 0.05mm |
Roughness | 0.8μm |
Plating Quality Test | N2 450±10°C, 15 min |
Temperature Cycling | -55°C to 125°C, 20 cycles |
Thermal Shock | -55°C to 125°C, 20 cycles |
Mechanical Shock | Condition B, Y1 Direction, 10,000g |
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Quantity: | |
Appliations: Optical transmitters, optical detectors, optical modulators, amplifiers and high-power lasers. Widely used in automotive electronics, optical communications, medical equipments and public safety.
Jitai's optoelectronic product line encompasses two primary categories: sealed housings featuring an optical window or fiber, and TO products (refer to the TO header page for specifics). Our sealed optoelectronic housings, fabricated with glass-to-metal or ceramic-to-metal insulators, find diverse applications in commercial lasers, laser diodes, signal transmission, and medical devices. We offer extensive customization options for structural requirements and material combinations, along with recommendations from our catalog of open-tooling products, widely employed across various applications.
Structural Options | Material Combinations | |||||
Frame | Base | Leads | Insulator | Eyelet | Suitable Applications | |
One Piece Machined | N/A | OFHC | Alloy52/Copper Cored Alloy52 | Glass/Ceramic | CRS1010 | Big-sized packages with output power less than 40W |
N/A | Alumunium | |||||
Two-piece Soldered | CRS | OFHC | Alloy52/Copper Cored Alloy52 | N/A | Small-sized packages with output power less than 40W | |
Stainless Steel | OFHC | |||||
Kovar | WCu | Copper Cored Kovar | ||||
Kovar | Kovar | Kovar |
Additional designs. We manufacture thousands of models; if you do not see what you are looking for please contact us.
MDFO2113-W14 | |||||||||
Parts | Base | Frame | Solder Ring | Solder Frame | Leads | Insulator | Ferrule | ||
Materials | CRS | CRS | HLAgcu28 | HLAgcu28 | Kovar | BH-A/K/Elan #13 | Zirconia Ceramic | ||
Leads Design | Protrude from side | ||||||||
Plating | Housing:Ni 1.9~15.00μm,Au≥0.5μm;Leads:Ni1.9~8.00μm,Au≥0.5μm | ||||||||
Insulation Resistance | 500V DC resistance between single glass sealed pin and base is ≥1×10^10Ω | ||||||||
Hermeticity | Leak rate is ≤1×10^-3 Pa·cm 3/s |
MDFO1509-W10 | ||||||||||
Parts | Base | Frame | Solder Ring | Solder Frame | Leads | Insulator | Tube | Ferrule | ||
Materials | W80Cu20 | Kovar | HLAgcu28 | HLAgcu28 | Kovar | BH-A/K/Elan #13 | CRS | Zirconia Ceramic | ||
Leads Design | Protrude from side | |||||||||
Plating | Housing and Leads :Ni ≥1.9μm,Au≥0.5μm | |||||||||
Insulation Resistance | 100V DC resistance between single glass sealed pin and base is ≥1×10^6 Ω | |||||||||
Hermeticity | Leak rate is ≤1×10^-3 Pa·cm 3/s |
Description: butterfly package, multi-piece structure, glass to metal seal, 6 leads with flattened wire bonding tips, copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.
MDFO0909-w6 | |||||
Base | Frame | Tube | Leads | ||
Materials | W80Cu20 | 4J29 | |||
Plating | Ni: ≥2.5μm, Au: ≥0.6μm | ||||
Dimensions | L:17mm,W:10mm,H:7.3±0.25mm | ||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.2mm |
Description: 8 leads with flattened wire bonding tips, copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.
MDFO1413-w8 | |||||
Base | Frame | Leads | Tube | ||
Materials | W85Cu15 | 4J29 | 4J29 | 4J29 | |
Plating | Ni:1.3~11.43μm, Au:≥0.7μm | ||||
Dimensions | L:13.5mm W:13.1mm H:7.1mm±0.15 | ||||
Lead current carrying capacity | ≥1× 1010 Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecifiedtolerances are ±0.2mm |
Description: glass to metal seal, multi-piece structure, butterfly package, 16 rectangular shape leads , copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.
MDFO1413-w16b | ||||
Base | Frame | Leads | ||
Materials | W80Cu20 | 4J29 | ||
Plating | Ni:1.3~11.43μm, Au: 0.3μm | |||
Dimensions | L:13.5mm,W:12.6mm,H:8mm | |||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: 13+1 ground lead, Kovar plug-in package, with fiber optic channel, Au finishing.
MDFO2113-p14g | ||||||
Housing | Leads | Tube | Insulator | Solder ring | ||
Materials | 4J29 | 4J29 | 4J29 | BH-G/K | HLAgCu28 | |
Plating | Ni:2.5~8.9μm, Au: ≥0.75μm | |||||
Dimensions | L:20.8mm,W:12.7mm,H:4.57mm | |||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||||
Note | Unspecified tolerances are ±0.2mm |
Description: 14 leads with flattened wire bonding tips, Kovar butterfly package, with flange and fiber optic channel, Au finishing.
MDFO3013-w14 | |||
Housing | Leads | ||
Materials | 4J29 | 4J29 | |
Plating | Ni:1.3~11.43μm, Au: ≥0.6μm | Ni: 1.3~11.43μm, Au: ≥1μm | |
Dimensions | L:30mm±0.15,W:13mm±0.15 H:7.5mm±0.15 | ||
Insulation resistance | ≥1× 1010 Ω (500V DC) | ||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||
Note | Unspecified tolerances are ±0.1mm |
Description: glass to metal seal, 28 leads Kovar package, with fiber optic channel and assembly eyelids, Au finishing.
MDFO6866-p28 | ||||||
Housing | Tube | Leads | Insulator | Solder ring | ||
Materials | 4J29 | DM308 | HLAgCu28 | |||
Plating | Ni:1.3~8.9μm, Au: ≥1μm | Ni:1.3~8.9μm, Au: ≥1.3μm | ||||
Dimensions | L:68mm,W:66mm,H:12.75mm | |||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, 54 leads Kovar package, with fiber optic channel and assembly eyelids, Au finishing.
MDFO6866-p54 | ||||||
Housing | Tube | Leads | Insulator | Solder ring | ||
Materials | 4J29 | DM308 | HLAgCu28 | |||
Plating | Ni:1.3~8.9μm, Au: ≥1μm | Ni:1.3~8.9μm, Au: ≥1.3μm | ||||
Dimensions | L:68mm,W:66mm,H:12.75mm | |||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, high power opto-electronic package, 304 stainless steel housing, 4 bent alloy 50 leads, with assembly eyelid, flange and fiber optic channel, Au finishing.
MSFM9015-g4 | ||||
Housing | Tube | Leads | ||
Materials | 304 stainless steel | 4J50 | ||
Plating | Ni: 3~15μm, Au: ≥1μm | |||
Dimensions | L:90mm,W:14.5mm,H:10mm | |||
Insulation resistance | ≥1× 109 Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, 6 leads with flattened wire bonding tips, Kovar package, with flange and fiber optic channel, Au finishing.
MSFO1710-w6 | ||||
Housing | Tube | Leads | ||
Materials | 4J29 | |||
Plating | Ni:1.3~11.43μm, Au: ≥0.5μm | |||
Dimensions | L:17mm,W:10mm,H:7.3±0.25mm | |||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: 2 leads, Kovar package, with triple fiber optic channels, Au finishing.
MSFO2006-p2 | ||||||
Housing | Leads | Tube | Insulator | Solder ring | ||
Materials | 4J29 | 4J29 | 4J29 | BH-A/K | HLAgCu28 | |
Plating | Ni:1.3~11.43μm, Au: ≥0.5μm | |||||
Dimensions | L:20mm,W:5.6mm-0.1 H:4.4mm | |||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||||
Note | Unspecified tolerances are ±0.2mm |
Description: 6 leads, copper-tungsten base soldered to Kovar frame, with fiber optic channel, Au finishing.
MSFO6243-w6b | |||||||
Base | Frame | Leads | Tube | Solder ring | Insulator | ||
Materials | W85Cu15 | 4J29 | 4J29 | 4J29 | HLAgCn28 | DM-305 | |
Plating | Ni:3~9μm, Au:0.05~0.25μm | ||||||
Dimensions | L:62mm±0.1 W:43mm±0.1 H:13.8mm±0.1 | ||||||
Lead current carrying capacity | At 2A constant current, it can withstand a pulse 4A current peak for 30 seconds | ||||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||||
Solderiing | Solder spillage should not exceed 1mm from the edge | ||||||
Note | Unspecifiedtolerances are ±0.2mm |
Applicable Standards
Guiding Standard | ISO9001/GJB2440/GJB548/MIL883/JEDEC NO.9 |
Design and Reliability | GJB2440/GJB548/MIL883 |
Gold Plating | MIL-G-45204 |
Nickel Plating | QQ-N-290 |
Visual Inspection | JEDEC NO.9 |
QUALITY CONTROL
Throughout our evolution, we have refined a meticulous multi-step process to ensure each component surpasses stringent quality and functionality standards, commencing even before raw materials are acquired. Initially, incoming raw materials undergo an acceptance sampling method to determine acceptance. Accepted materials undergo thorough cleaning, full inspection, and minor imperfection rectification before warehousing. Subsequently, following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, employing a helium leak test tailored to client specifications. Post-plating, batches undergo sampling inspection and coating bonding degree analysis. Approved products undergo an extensive inspection process, meticulously assessing appearance, construction, plating thickness, and undergoing a secondary helium tracer gas hermeticity test. Subsequently, products undergo a range of Factory Inspection trials, including pin fatigue and salt spray corrosion resistance tests, alongside climate simulation analysis for performance evaluation. Approved products are then vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery.
Appliations: Optical transmitters, optical detectors, optical modulators, amplifiers and high-power lasers. Widely used in automotive electronics, optical communications, medical equipments and public safety.
Jitai's optoelectronic product line encompasses two primary categories: sealed housings featuring an optical window or fiber, and TO products (refer to the TO header page for specifics). Our sealed optoelectronic housings, fabricated with glass-to-metal or ceramic-to-metal insulators, find diverse applications in commercial lasers, laser diodes, signal transmission, and medical devices. We offer extensive customization options for structural requirements and material combinations, along with recommendations from our catalog of open-tooling products, widely employed across various applications.
Structural Options | Material Combinations | |||||
Frame | Base | Leads | Insulator | Eyelet | Suitable Applications | |
One Piece Machined | N/A | OFHC | Alloy52/Copper Cored Alloy52 | Glass/Ceramic | CRS1010 | Big-sized packages with output power less than 40W |
N/A | Alumunium | |||||
Two-piece Soldered | CRS | OFHC | Alloy52/Copper Cored Alloy52 | N/A | Small-sized packages with output power less than 40W | |
Stainless Steel | OFHC | |||||
Kovar | WCu | Copper Cored Kovar | ||||
Kovar | Kovar | Kovar |
Additional designs. We manufacture thousands of models; if you do not see what you are looking for please contact us.
MDFO2113-W14 | |||||||||
Parts | Base | Frame | Solder Ring | Solder Frame | Leads | Insulator | Ferrule | ||
Materials | CRS | CRS | HLAgcu28 | HLAgcu28 | Kovar | BH-A/K/Elan #13 | Zirconia Ceramic | ||
Leads Design | Protrude from side | ||||||||
Plating | Housing:Ni 1.9~15.00μm,Au≥0.5μm;Leads:Ni1.9~8.00μm,Au≥0.5μm | ||||||||
Insulation Resistance | 500V DC resistance between single glass sealed pin and base is ≥1×10^10Ω | ||||||||
Hermeticity | Leak rate is ≤1×10^-3 Pa·cm 3/s |
MDFO1509-W10 | ||||||||||
Parts | Base | Frame | Solder Ring | Solder Frame | Leads | Insulator | Tube | Ferrule | ||
Materials | W80Cu20 | Kovar | HLAgcu28 | HLAgcu28 | Kovar | BH-A/K/Elan #13 | CRS | Zirconia Ceramic | ||
Leads Design | Protrude from side | |||||||||
Plating | Housing and Leads :Ni ≥1.9μm,Au≥0.5μm | |||||||||
Insulation Resistance | 100V DC resistance between single glass sealed pin and base is ≥1×10^6 Ω | |||||||||
Hermeticity | Leak rate is ≤1×10^-3 Pa·cm 3/s |
Description: butterfly package, multi-piece structure, glass to metal seal, 6 leads with flattened wire bonding tips, copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.
MDFO0909-w6 | |||||
Base | Frame | Tube | Leads | ||
Materials | W80Cu20 | 4J29 | |||
Plating | Ni: ≥2.5μm, Au: ≥0.6μm | ||||
Dimensions | L:17mm,W:10mm,H:7.3±0.25mm | ||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecified tolerances are ±0.2mm |
Description: 8 leads with flattened wire bonding tips, copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.
MDFO1413-w8 | |||||
Base | Frame | Leads | Tube | ||
Materials | W85Cu15 | 4J29 | 4J29 | 4J29 | |
Plating | Ni:1.3~11.43μm, Au:≥0.7μm | ||||
Dimensions | L:13.5mm W:13.1mm H:7.1mm±0.15 | ||||
Lead current carrying capacity | ≥1× 1010 Ω (500V DC) | ||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||
Note | Unspecifiedtolerances are ±0.2mm |
Description: glass to metal seal, multi-piece structure, butterfly package, 16 rectangular shape leads , copper-tungsten base soldered to Kovar frame, with flange and fiber optic channel, Au finishing.
MDFO1413-w16b | ||||
Base | Frame | Leads | ||
Materials | W80Cu20 | 4J29 | ||
Plating | Ni:1.3~11.43μm, Au: 0.3μm | |||
Dimensions | L:13.5mm,W:12.6mm,H:8mm | |||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: 13+1 ground lead, Kovar plug-in package, with fiber optic channel, Au finishing.
MDFO2113-p14g | ||||||
Housing | Leads | Tube | Insulator | Solder ring | ||
Materials | 4J29 | 4J29 | 4J29 | BH-G/K | HLAgCu28 | |
Plating | Ni:2.5~8.9μm, Au: ≥0.75μm | |||||
Dimensions | L:20.8mm,W:12.7mm,H:4.57mm | |||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||||
Note | Unspecified tolerances are ±0.2mm |
Description: 14 leads with flattened wire bonding tips, Kovar butterfly package, with flange and fiber optic channel, Au finishing.
MDFO3013-w14 | |||
Housing | Leads | ||
Materials | 4J29 | 4J29 | |
Plating | Ni:1.3~11.43μm, Au: ≥0.6μm | Ni: 1.3~11.43μm, Au: ≥1μm | |
Dimensions | L:30mm±0.15,W:13mm±0.15 H:7.5mm±0.15 | ||
Insulation resistance | ≥1× 1010 Ω (500V DC) | ||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||
Note | Unspecified tolerances are ±0.1mm |
Description: glass to metal seal, 28 leads Kovar package, with fiber optic channel and assembly eyelids, Au finishing.
MDFO6866-p28 | ||||||
Housing | Tube | Leads | Insulator | Solder ring | ||
Materials | 4J29 | DM308 | HLAgCu28 | |||
Plating | Ni:1.3~8.9μm, Au: ≥1μm | Ni:1.3~8.9μm, Au: ≥1.3μm | ||||
Dimensions | L:68mm,W:66mm,H:12.75mm | |||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, 54 leads Kovar package, with fiber optic channel and assembly eyelids, Au finishing.
MDFO6866-p54 | ||||||
Housing | Tube | Leads | Insulator | Solder ring | ||
Materials | 4J29 | DM308 | HLAgCu28 | |||
Plating | Ni:1.3~8.9μm, Au: ≥1μm | Ni:1.3~8.9μm, Au: ≥1.3μm | ||||
Dimensions | L:68mm,W:66mm,H:12.75mm | |||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, high power opto-electronic package, 304 stainless steel housing, 4 bent alloy 50 leads, with assembly eyelid, flange and fiber optic channel, Au finishing.
MSFM9015-g4 | ||||
Housing | Tube | Leads | ||
Materials | 304 stainless steel | 4J50 | ||
Plating | Ni: 3~15μm, Au: ≥1μm | |||
Dimensions | L:90mm,W:14.5mm,H:10mm | |||
Insulation resistance | ≥1× 109 Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: glass to metal seal, 6 leads with flattened wire bonding tips, Kovar package, with flange and fiber optic channel, Au finishing.
MSFO1710-w6 | ||||
Housing | Tube | Leads | ||
Materials | 4J29 | |||
Plating | Ni:1.3~11.43μm, Au: ≥0.5μm | |||
Dimensions | L:17mm,W:10mm,H:7.3±0.25mm | |||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||
Note | Unspecified tolerances are ±0.2mm |
Description: 2 leads, Kovar package, with triple fiber optic channels, Au finishing.
MSFO2006-p2 | ||||||
Housing | Leads | Tube | Insulator | Solder ring | ||
Materials | 4J29 | 4J29 | 4J29 | BH-A/K | HLAgCu28 | |
Plating | Ni:1.3~11.43μm, Au: ≥0.5μm | |||||
Dimensions | L:20mm,W:5.6mm-0.1 H:4.4mm | |||||
Insulation resistance | ≥1× 1010 Ω (500V DC) | |||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | |||||
Note | Unspecified tolerances are ±0.2mm |
Description: 6 leads, copper-tungsten base soldered to Kovar frame, with fiber optic channel, Au finishing.
MSFO6243-w6b | |||||||
Base | Frame | Leads | Tube | Solder ring | Insulator | ||
Materials | W85Cu15 | 4J29 | 4J29 | 4J29 | HLAgCn28 | DM-305 | |
Plating | Ni:3~9μm, Au:0.05~0.25μm | ||||||
Dimensions | L:62mm±0.1 W:43mm±0.1 H:13.8mm±0.1 | ||||||
Lead current carrying capacity | At 2A constant current, it can withstand a pulse 4A current peak for 30 seconds | ||||||
Hermeticity | ≤ 1 x 10-3 Pa * cm3 /s | ||||||
Solderiing | Solder spillage should not exceed 1mm from the edge | ||||||
Note | Unspecifiedtolerances are ±0.2mm |
Applicable Standards
Guiding Standard | ISO9001/GJB2440/GJB548/MIL883/JEDEC NO.9 |
Design and Reliability | GJB2440/GJB548/MIL883 |
Gold Plating | MIL-G-45204 |
Nickel Plating | QQ-N-290 |
Visual Inspection | JEDEC NO.9 |
QUALITY CONTROL
Throughout our evolution, we have refined a meticulous multi-step process to ensure each component surpasses stringent quality and functionality standards, commencing even before raw materials are acquired. Initially, incoming raw materials undergo an acceptance sampling method to determine acceptance. Accepted materials undergo thorough cleaning, full inspection, and minor imperfection rectification before warehousing. Subsequently, following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, employing a helium leak test tailored to client specifications. Post-plating, batches undergo sampling inspection and coating bonding degree analysis. Approved products undergo an extensive inspection process, meticulously assessing appearance, construction, plating thickness, and undergoing a secondary helium tracer gas hermeticity test. Subsequently, products undergo a range of Factory Inspection trials, including pin fatigue and salt spray corrosion resistance tests, alongside climate simulation analysis for performance evaluation. Approved products are then vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery.
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