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Concept to Packages: Packaging Strategies for MEMS, Sensors & Microdevices

Turning a promising MEMS or sensor concept into a reliable, manufacturable product requires more than design brilliance—it demands smart packaging. From initial prototyping to volume production, packaging defines the interface between delicate microstructures and the real world. It governs signal in

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2025 10-11
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Hermetic vs. Near-Hermetic: Which Sealing Approach Fits Your Application?

In advanced electronics and sensor manufacturing, sealing is more than a mechanical concern—it’s a reliability strategy. The decision between hermetic and near-hermetic sealing determines how well your device endures moisture, temperature, and time. For high-reliability industries like aerospace or

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2025 10-10
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Custom vs. Standard Hermetic Packages: Pros, Cons, and When to Go Custom

In high-reliability electronics, packaging is not just a mechanical enclosure—it’s a critical design decision that directly determines product lifetime and performance. Hermetic packages protect sensitive components from moisture, gas, and contaminants that could otherwise compromise functionality.

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2025 10-10
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Testing and Qualification of Hermetic Packages: Leak Detection, Standards & Methods

In critical electronics and sensor systems, a hermetic seal is far more than a manufacturing detail—it’s the lifeline that keeps contaminants out and reliability intact. Whether in satellites, pacemakers, or photonic modules, even the tiniest leak can trigger failure after months or years of flawles

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2025 10-10
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Comparing Metal Ceramic Packages with Hermetic Glass-to-Metal Seals: Cost and ROI

In electronic and optoelectronic packaging, two solutions often stand out for high-reliability environments: metal ceramic packages and hermetic glass-to-metal seals. While both approaches deliver the critical function of protecting sensitive devices from moisture, contaminants, and harsh operating

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2025 09-08
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The Role of Opto-Electronic Packaging in the Photonics Supply Chain

Photonics is reshaping industries from telecommunications to healthcare, and at the center of this transformation lies a less visible yet absolutely critical discipline: opto-electronic packaging. While photonic chips and devices grab the headlines, packaging is the bridge that makes them usable, re

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2025 09-08
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Hermetic Packages vs. Non-Hermetic Packages:Cost, ROI, and Risk Analysis

Technologies for packaging are essential in a variety of sectors, including electronics, aerospace, pharmaceuticals, and food. Among the key considerations in packaging selection are whether to use hermetic packages—airtight enclosures that fully seal the contents—or non-hermetic packages, which off

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2025 09-05
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Comparing Hermetic Packaging Materials: Ceramic, Metal, and Glass Options

When designing devices or products that require complete isolation from environmental factors—especially moisture, gas, or contaminants—hermetic packaging is essential. Achieving a hermetic seal ensures reliability, longevity, and protection of sensitive internal components, whether they are electro

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2025 09-05
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Metal Ceramic Packages: Hermeticity Testing Methods That Prevent Field Failures

Hermeticity is the single biggest lever for reliability in metal-ceramic packages. Even trace moisture or reactive gases can corrode leads, drift optics, and poison die attach—leading to intermittent faults that only appear after shipment. The right test stack prevents those surprises.

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2025 08-20
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