EnglishEnglish

News

Home / News
SMD Packages.png
Moisture Sensitivity Levels (MSL) in SMD Packages: How It Affects Your Production Quality

Moisture sensitivity is one of the most overlooked risks in modern SMT production, yet it directly affects yield, long-term reliability, and overall manufacturing quality. When SMD components absorb moisture and later experience high temperatures during reflow, they can crack, delaminate, or fail en

READ MORE
2025 11-18
Ceramic Package.jpg
Top 7 Ceramic Hermetic Package Designs for Modern Electronic Components

As electronic devices demand higher performance, smaller footprints, and greater durability, packaging technology has become just as important as the semiconductor itself. Ceramic hermetic packages offer exceptional protection against moisture, corrosion, and thermal stress, making them essential in

READ MORE
2025 11-18
Transistor Outline Packages.png
TO-5, TO-18, and TO-39: What’s the Difference and Where to Use Each Package

In the world of semiconductors, packaging is far more than a protective shell — it is a vital component that determines how efficiently a device performs, dissipates heat, and survives harsh environments. Among the many standardized metal can packages developed for transistors, sensors, and optoelec

READ MORE
2025 11-04
SMD packages.jpg
Comparing SOT, QFN, and DFN: Which SMD Package Fits Your Design?

In the rapidly evolving electronics industry, package selection is as vital as the chip itself. A good package ensures mechanical protection, thermal efficiency, electrical stability, and manufacturability. As devices shrink and gain functionality, engineers must balance space, cost, and reliability

READ MORE
2025 11-04
Opto-Electronic Packages.jpg
Glass, Alumina, Kovar: Material Choices in Optoelectronic Packages

Optoelectronic devices—ranging from laser diodes and photodetectors to fiber-optic transceivers—depend heavily on the quality of their packaging. The optoelectronic package protects sensitive chips and optical interfaces from contamination, moisture, and mechanical stress, while ensuring thermal sta

READ MORE
2025 11-03
Opto-Electronic Packages.png
COB, TO-Can, Butterfly: Choosing the Right Optoelectronic Packages

Optoelectronic packaging refers to the mechanical and thermal structure that houses optical and electronic components, ensuring alignment, protection, and efficient heat dissipation. In applications ranging from data-center communication to industrial sensing, the packaging type significantly affect

READ MORE
2025 11-03
Hermetic Packages.jpg
Concept to Packages: Packaging Strategies for MEMS, Sensors & Microdevices

Turning a promising MEMS or sensor concept into a reliable, manufacturable product requires more than design brilliance—it demands smart packaging. From initial prototyping to volume production, packaging defines the interface between delicate microstructures and the real world. It governs signal in

READ MORE
2025 10-11
IMG_3452.jpeg
Hermetic vs. Near-Hermetic: Which Sealing Approach Fits Your Application?

In advanced electronics and sensor manufacturing, sealing is more than a mechanical concern—it’s a reliability strategy. The decision between hermetic and near-hermetic sealing determines how well your device endures moisture, temperature, and time. For high-reliability industries like aerospace or

READ MORE
2025 10-10
IMG_3451.jpeg
Custom vs. Standard Hermetic Packages: Pros, Cons, and When to Go Custom

In high-reliability electronics, packaging is not just a mechanical enclosure—it’s a critical design decision that directly determines product lifetime and performance. Hermetic packages protect sensitive components from moisture, gas, and contaminants that could otherwise compromise functionality.

READ MORE
2025 10-10
   Yixing City Jitai Electronics Co.,Ltd.
   Whatsapp:+86 18916250130
© Copyright - 2010-2024 : All Rights Reserved.
Hot Products - Sitemap
Leave a Message
Leave Your Message