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TO-5, TO-18, and TO-39: What’s the Difference and Where to Use Each Package

In the world of semiconductors, packaging is far more than a protective shell — it is a vital component that determines how efficiently a device performs, dissipates heat, and survives harsh environments. Among the many standardized metal can packages developed for transistors, sensors, and optoelec

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2025 11-04
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Comparing SOT, QFN, and DFN: Which SMD Package Fits Your Design?

In the rapidly evolving electronics industry, package selection is as vital as the chip itself. A good package ensures mechanical protection, thermal efficiency, electrical stability, and manufacturability. As devices shrink and gain functionality, engineers must balance space, cost, and reliability

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2025 11-04
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Glass, Alumina, Kovar: Material Choices in Optoelectronic Packages

Optoelectronic devices—ranging from laser diodes and photodetectors to fiber-optic transceivers—depend heavily on the quality of their packaging. The optoelectronic package protects sensitive chips and optical interfaces from contamination, moisture, and mechanical stress, while ensuring thermal sta

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2025 11-03
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COB, TO-Can, Butterfly: Choosing the Right Optoelectronic Packages

Optoelectronic packaging refers to the mechanical and thermal structure that houses optical and electronic components, ensuring alignment, protection, and efficient heat dissipation. In applications ranging from data-center communication to industrial sensing, the packaging type significantly affect

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2025 11-03
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Concept to Packages: Packaging Strategies for MEMS, Sensors & Microdevices

Turning a promising MEMS or sensor concept into a reliable, manufacturable product requires more than design brilliance—it demands smart packaging. From initial prototyping to volume production, packaging defines the interface between delicate microstructures and the real world. It governs signal in

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2025 10-11
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Hermetic vs. Near-Hermetic: Which Sealing Approach Fits Your Application?

In advanced electronics and sensor manufacturing, sealing is more than a mechanical concern—it’s a reliability strategy. The decision between hermetic and near-hermetic sealing determines how well your device endures moisture, temperature, and time. For high-reliability industries like aerospace or

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2025 10-10
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Custom vs. Standard Hermetic Packages: Pros, Cons, and When to Go Custom

In high-reliability electronics, packaging is not just a mechanical enclosure—it’s a critical design decision that directly determines product lifetime and performance. Hermetic packages protect sensitive components from moisture, gas, and contaminants that could otherwise compromise functionality.

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2025 10-10
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Testing and Qualification of Hermetic Packages: Leak Detection, Standards & Methods

In critical electronics and sensor systems, a hermetic seal is far more than a manufacturing detail—it’s the lifeline that keeps contaminants out and reliability intact. Whether in satellites, pacemakers, or photonic modules, even the tiniest leak can trigger failure after months or years of flawles

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2025 10-10
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Comparing Metal Ceramic Packages with Hermetic Glass-to-Metal Seals: Cost and ROI

In electronic and optoelectronic packaging, two solutions often stand out for high-reliability environments: metal ceramic packages and hermetic glass-to-metal seals. While both approaches deliver the critical function of protecting sensitive devices from moisture, contaminants, and harsh operating

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2025 09-08
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