Author: Site Editor Publish Time: 06-21-2024 Origin: Site
Jitai Electronics Co., Ltd. is pleased to announce our participation in COMNEXT 2024Event.
The exhibition will be held June 26th to the 28th, 2024 in Tokyo Japan. The event will take place at Tokyo Big Sight and will focus primarily on Next Generation Communication Technology. COMNEXT, which was formerly known as Communications & Broadcasting Week, is an international BtoB exhibition that sets its sights on next-generation communication technologies, such as 6G, Private 5G, IoT, optical communications, and video transmission.
COMNEXT follows on the heels of the immensely popular Fiber Optics Expo (FOE). The show's newest iteration pledges to offer many exciting opportunities for the sharing of ideas, networking and innovation. On offer will be products such as 8K displays and the chance to experience solutions related to Edge AI, satellite communication, Wi-Fi 6, and IoT security. Whether you are an industry professional or simply interested in staying on top of the latest developments in communication technologies, COMNEXT is the place to be. The event brings together industry-leading professionals worldwide to showcase the latest breakthroughs and share insights on the industry’s newest trends. Jitai is eagerly looking forward to meeting with like-minded companies for in depth discussions about the future of communications and the increasingly important role hermetic packaging is playing.
In the last two years Jitai has initiated several new product lines, for example ceramic packages that serve the requirements of the GaN package industry. As the communication industry moves towards a need for increased current density in addition to switching speeds, gallium nitride (GaN) package solutions have become a much sought-after solution. Jitai is proud to have achieved much success in this field and is eager to discuss these achievements with COMNEXT show-goers.
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