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English  |
Main series: CLCC ,CQFP, CBGA, CDIP, CFP, MCM, CSOP
Applications:
Widely used in computers, radar, communication equipment and aerospace.
| Quantity: | |
|---|---|
The advantages of ceramic packages are superb air tightness, high thermal conductivity, excellent mechanical strength, high insulation resistance and a thermal expansion coefficient that is compatible with chip materials.
Type | Leads layout | Leads count | Leads to center distance |
CDIP | Double in line | 6~64 | 2.54mm |
CQFP | Quadruple in line | 24~176 | 1.27/1.0/0.8/0.65/0.5mm |
CLCC | ∕ | ∕ | 2.54/1.27/0.65mm |
CSOP | Double in line | ∕ | 2.54/1.27/1.0/0.8/0.6mm |
CFP | ∕ | ∕ | 2.54/1.27/0.65mm |
Product Name | CLCC-20A |
Ceramic strength | ≥400MPa |
Plating | Base plated Ni≥5µm, Au 0.4-0.8 µm |
Insulation Resistance | 500 V DC, insulation resistance ≥ 1 × 1010 Ω |
On-State- Resistance | ≤0.3Ω |
Hermeticity | Leakage rate(He)≤ 1 × 10⁻³ Pa·cm³/s |
Unspecified Tolerance | ± 0.1 mm |
Product Name | M0605b |
Material | Base is 92%Al2O3; Frame is 4J29(Kovar) |
Plating | Base and Frame plated Ni 1.3–11.43 µm, Au ≥ 1.0 µm(leading-out terminal Au≥ 1.3 µm) |
Hermeticity | Leakage rate(He)≤ 1 × 10⁻³ Pa·cm³/s |
Unspecified Tolerance | ± 0.2 mm |
Product Name | M1209b |
Material | Base is 92%Al2O3; Frame and Pins are 4J29(Kovar) |
Plating | Base, Frame, and Pins plated Ni 2.5–11.4 µm, Au 1.3-5.7 µm |
Temperature Cycling | -65℃ to 150℃,100 cycles |
Thermal Shock | GJB548B-2005, Method 1011, Test Condition C,15 Cycles |
Stabilization Bake | 150℃,1h |
Insulation Resistance | 500V DC, insulation resistance between two isolated points≥ 1 × 1010 Ω |
Coating Quality | After 15 minutes at 820℃ in a hydrogen atmosphere furnace,the material must exhibit no scaling and no blistering |
Unspecified Tolerance | ± 0.05 mm |
Product Name | SMD-01 |
Material | 1: is MoCu15,3 is Al2O3 ,2,4,5 are 4J29(Kovar) |
Plating | Base plated Ni 4–11.43 µm, Au 0.3-0.6 µm |
Insulation Resistance | 500 V DC, insulation resistance ≥ 1 × 10⁹ Ω |
Hermeticity | Leakage rate(He)≤ 1 × 10⁻³ Pa·cm³/s |
Unspecified Tolerance | ± 0.1 mm, Fillets are not subject to inspection |
Product Name | SMD-1 |
Material | 1: is WCu15,2 is 4J29,3 is Al2O3 ,4 is 4J34 |
Plating | Base plated Ni 3–11.43 µm, Au 0.3-0.6 µm |
Insulation Resistance | 500 V DC, insulation resistance ≥ 1 × 10⁹ Ω |
Hermeticity | Leakage rate(He)≤ 1 × 10⁻³ Pa·cm³/s |
Unspecified Tolerance | ± 0.15 mm, Fillets are not subject to inspection |
The advantages of ceramic packages are superb air tightness, high thermal conductivity, excellent mechanical strength, high insulation resistance and a thermal expansion coefficient that is compatible with chip materials.
Type | Leads layout | Leads count | Leads to center distance |
CDIP | Double in line | 6~64 | 2.54mm |
CQFP | Quadruple in line | 24~176 | 1.27/1.0/0.8/0.65/0.5mm |
CLCC | ∕ | ∕ | 2.54/1.27/0.65mm |
CSOP | Double in line | ∕ | 2.54/1.27/1.0/0.8/0.6mm |
CFP | ∕ | ∕ | 2.54/1.27/0.65mm |
Product Name | CLCC-20A |
Ceramic strength | ≥400MPa |
Plating | Base plated Ni≥5µm, Au 0.4-0.8 µm |
Insulation Resistance | 500 V DC, insulation resistance ≥ 1 × 1010 Ω |
On-State- Resistance | ≤0.3Ω |
Hermeticity | Leakage rate(He)≤ 1 × 10⁻³ Pa·cm³/s |
Unspecified Tolerance | ± 0.1 mm |
Product Name | M0605b |
Material | Base is 92%Al2O3; Frame is 4J29(Kovar) |
Plating | Base and Frame plated Ni 1.3–11.43 µm, Au ≥ 1.0 µm(leading-out terminal Au≥ 1.3 µm) |
Hermeticity | Leakage rate(He)≤ 1 × 10⁻³ Pa·cm³/s |
Unspecified Tolerance | ± 0.2 mm |
Product Name | M1209b |
Material | Base is 92%Al2O3; Frame and Pins are 4J29(Kovar) |
Plating | Base, Frame, and Pins plated Ni 2.5–11.4 µm, Au 1.3-5.7 µm |
Temperature Cycling | -65℃ to 150℃,100 cycles |
Thermal Shock | GJB548B-2005, Method 1011, Test Condition C,15 Cycles |
Stabilization Bake | 150℃,1h |
Insulation Resistance | 500V DC, insulation resistance between two isolated points≥ 1 × 1010 Ω |
Coating Quality | After 15 minutes at 820℃ in a hydrogen atmosphere furnace,the material must exhibit no scaling and no blistering |
Unspecified Tolerance | ± 0.05 mm |
Product Name | SMD-01 |
Material | 1: is MoCu15,3 is Al2O3 ,2,4,5 are 4J29(Kovar) |
Plating | Base plated Ni 4–11.43 µm, Au 0.3-0.6 µm |
Insulation Resistance | 500 V DC, insulation resistance ≥ 1 × 10⁹ Ω |
Hermeticity | Leakage rate(He)≤ 1 × 10⁻³ Pa·cm³/s |
Unspecified Tolerance | ± 0.1 mm, Fillets are not subject to inspection |
Product Name | SMD-1 |
Material | 1: is WCu15,2 is 4J29,3 is Al2O3 ,4 is 4J34 |
Plating | Base plated Ni 3–11.43 µm, Au 0.3-0.6 µm |
Insulation Resistance | 500 V DC, insulation resistance ≥ 1 × 10⁹ Ω |
Hermeticity | Leakage rate(He)≤ 1 × 10⁻³ Pa·cm³/s |
Unspecified Tolerance | ± 0.15 mm, Fillets are not subject to inspection |
