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English  |
Main series: CLCC ,CQFP, CBGA, CDIP, CFP, MCM, CSOP
Applications:
Widely used in computers, radar, communication equipment and aerospace.
| Quantity: | |
|---|---|
The advantages of ceramic packages are superb air tightness, high thermal conductivity, excellent mechanical strength, high insulation resistance and a thermal expansion coefficient that is compatible with chip materials.
Type | Leads layout | Leads count | Leads to center distance |
CDIP | Double in line | 6~64 | 2.54mm |
CQFP | Quadruple in line | 24~176 | 1.27/1.0/0.8/0.65/0.5mm |
CLCC | ∕ | ∕ | 2.54/1.27/0.65mm |
CSOP | Double in line | ∕ | 2.54/1.27/1.0/0.8/0.6mm |
CFP | ∕ | ∕ | 2.54/1.27/0.65mm |
The advantages of ceramic packages are superb air tightness, high thermal conductivity, excellent mechanical strength, high insulation resistance and a thermal expansion coefficient that is compatible with chip materials.
Type | Leads layout | Leads count | Leads to center distance |
CDIP | Double in line | 6~64 | 2.54mm |
CQFP | Quadruple in line | 24~176 | 1.27/1.0/0.8/0.65/0.5mm |
CLCC | ∕ | ∕ | 2.54/1.27/0.65mm |
CSOP | Double in line | ∕ | 2.54/1.27/1.0/0.8/0.6mm |
CFP | ∕ | ∕ | 2.54/1.27/0.65mm |
