Nonconventional / Special Materials

Features:

• Rapid heat dissipation and superior thermal conductivity address heat dissipation challenges commonly encountered in high-power device development.

• Controllable coefficient of thermal expansion enables alignment with chip specifications, preventing excessive thermal stress that may lead to device failure.

• Low density enhances overall product performance and efficiency.

Diamond/Copper, Diamond/Aluminum

SHORT DESCRIPTION:

Diamond/Copper and Diamond/Aluminum are composite materials featuring diamond as the reinforcing phase and copper or aluminum as the matrix material, making them highly competitive and promising in electronic packaging. These housings boast a chip area thermal conductivity of ≥500W/(m•K), meeting the demanding heat dissipation requirements of circuits. As research expands, these housing types are poised to play a progressively significant role in electronic packaging.

Features:

• Exceptional thermal conductivity

• Controllable coefficient of thermal expansion (CTE) through adjustment of diamond and Cu material proportions

• Low density

• Excellent machinability and workability, enabling wire cutting, grinding, and surface gold plating operations

AlN substrate

SHORT DESCRIPTION:

Aluminum nitride ceramic stands out as a technical material with remarkable thermal, mechanical, and electrical properties. Notably, it boasts high electrical conductivity, a small relative dielectric constant, a linear expansion coefficient that aligns with silicon, excellent electrical insulation, and low density. Non-toxic and durable, it has gained popularity as a base material or housing for packages, particularly with the expanding realm of microelectronic devices. Its versatility positions aluminum nitride ceramics as a promising material for high-power integrated circuit substrates and packaging.

Features:

• High thermal conductivity (approximately 270W/m•K), comparable to BeO and SiC, surpassing Al2O3 by over 5 times

• Thermal expansion coefficient aligns with Si and GaAs

• Exceptional electrical properties (low dielectric constant, dielectric loss, volume resistivity, and high dielectric strength)

• Strong mechanical resilience and superior machining capabilities

• Optimal optical and microwave characteristics

• Non-toxic

QUALITY CONTROL

Over the years, we have perfected our multi-step process to ensure that each component passes rigorous quality and functionality tests, starting from the initial stages before raw materials are even acquired. Upon arrival, raw materials undergo an acceptance sampling method to determine acceptance. If accepted, the entire shipment is thoroughly cleaned, inspected, and any minor imperfections are addressed before warehousing. Following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, adjusted to meet our clients' stringent air tightness requirements. Subsequently, after the plating stage, each batch undergoes sampling inspection and coating bonding degree analysis. Products passing this stage then undergo a comprehensive inspection, evaluating appearance, construction, plating thickness, and a second hermeticity test. Furthermore, they undergo a series of Factory Inspection trials, including pin fatigue tests, salt spray corrosion resistance tests, and climate simulation equipment analysis for performance assessment. Approved products are individually vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery, reflecting our commitment to maintaining product integrity from our factory to your hands.