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Nonconventional / Special Materials

With nearly twenty-five years of expertise in manufacturing hermetic packages, Jitai stands out as a frontrunner in the industry. Given the critical role of hermetic packages in safeguarding delicate electronics, Jitai prioritizes stringent quality control measures. Our refined multi-step process ensures that every component undergoes rigorous quality and performance tests. Once approved, products are meticulously vacuum-packed with deoxidizing desiccant inserts and further shielded with additional protective packaging before shipment, ensuring that each Jitai product maintains its high quality from our factory to your hands.
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NonconventionalSpecial-Materials

Aluminum Alloy Packages

SHORT DESCRIPTION:


Aluminum alloy offers several advantages, including lightweight construction, robust strength, and easy moldability, making it a popular choice for electronic packaging manufacturing.




Features:

  • Exceptional thermal conductivity

  • Lightweight design

  • Excellent machinability and workability, enabling wire cutting, grinding, and surface gold plating operations.



MODEL COEFFICIENT OF THERMAL EXPANSION/×10-6 /K THERMAL CONDUCTIVITY/W.(m.K)-1 THE DENSITY OF/g.cm-3
A1 6061 22.6 210 2.7
A1 4047 21.6 193 2.6


Aluminum-Silicon-Metal-Packages

Aluminum Silicon Metal Packages

SHORT DESCRIPTION:

Si/Al alloys used in electronic packages typically denote eutectic alloy compositions containing silicon ranging from 11% to 70%. These alloys boast low density, thermal expansion coefficients matching those of chips and substrates, and excellent heat dissipation capabilities. Their machining performance is also highly favorable, positioning Si/Al alloys as promising materials within the electronic packaging sector.


Features:

  • Rapid heat dissipation and superior thermal conductivity address heat dissipation challenges commonly encountered in high-power device development.

  • Controllable coefficient of thermal expansion enables alignment with chip specifications, preventing excessive thermal stress that may lead to device failure.

  • Low density enhances overall product performance and efficiency.


CE Alloy designation CE20 CE17 CE17M CE13 CE11 CE9 CE7
Alloy composition Al-12%Si Al-27%Si Al-27%Si* Al-42%Si Si-50%Al Si-40%Al Si-30%Al
CTE,ppm/℃,25-100℃ 20 16 16 12.8 11 9 7.4
Density,g/cm3 2.7 2.6 2.6 2.55 2.5 2.45 2.4
Thermal Conductivity at 25℃ W/mK
177 147 160 149 129 120
Bend Strength,MPa
210
213 172 140 143
Yield Strength,MPa
183
155 125 134 100
Elastic Modulus,GPa
92 92 107 121 124 129


DiamondCopper-DiamondAluminum

Diamond/Copper, Diamond/Aluminum

SHORT DESCRIPTION:

Diamond/Copper and Diamond/Aluminum are composite materials featuring diamond as the reinforcing phase and copper or aluminum as the matrix material, making them highly competitive and promising in electronic packaging. These housings boast a chip area thermal conductivity of ≥500W/(m•K), meeting the demanding heat dissipation requirements of circuits. As research expands, these housing types are poised to play a progressively significant role in electronic packaging.


Features:

  • Exceptional thermal conductivity

  • Controllable coefficient of thermal expansion (CTE) through adjustment of diamond and Cu material proportions

  • Low density

  • Excellent machinability and workability, enabling wire cutting, grinding, and surface gold plating operations


MODEL DIAMOND60%-COPPER40% DIAMOND40%-COPPER60% DIAMOND ALUMINUM
COEFFICIENT OF THERMAL EXPANSION/×10-4/K 4 6 7
THERMAL CONDUCTIVITY/W.(m.K)-1 600 550 >450
THE DENSITY OF/g.cm-3 4.6 5.1 3.2



AlN-substrate

AlN substrate

SHORT DESCRIPTION:

Aluminum nitride ceramic stands out as a technical material with remarkable thermal, mechanical, and electrical properties. Notably, it boasts high electrical conductivity, a small relative dielectric constant, a linear expansion coefficient that aligns with silicon, excellent electrical insulation, and low density. Non-toxic and durable, it has gained popularity as a base material or housing for packages, particularly with the expanding realm of microelectronic devices. Its versatility positions aluminum nitride ceramics as a promising material for high-power integrated circuit substrates and packaging.


Features:

  • High thermal conductivity (approximately 270W/m•K), comparable to BeO and SiC, surpassing Al2O3 by over 5 times

  • Thermal expansion coefficient aligns with Si and GaAs

  • Exceptional electrical properties (low dielectric constant, dielectric loss, volume resistivity, and high dielectric strength)

  • Strong mechanical resilience and superior machining capabilities

  • Optimal optical and microwave characteristics

  • Non-toxic


QUALITY CONTROL


Over the years, we have perfected our multi-step process to ensure that each component passes rigorous quality and functionality tests, starting from the initial stages before raw materials are even acquired. Upon arrival, raw materials undergo an acceptance sampling method to determine acceptance. If accepted, the entire shipment is thoroughly cleaned, inspected, and any minor imperfections are addressed before warehousing. Following initial assembly and brazing, each product undergoes individual visual inspection and a preliminary hermeticity test, adjusted to meet our clients' stringent air tightness requirements. Subsequently, after the plating stage, each batch undergoes sampling inspection and coating bonding degree analysis. Products passing this stage then undergo a comprehensive inspection, evaluating appearance, construction, plating thickness, and a second hermeticity test. Furthermore, they undergo a series of Factory Inspection trials, including pin fatigue tests, salt spray corrosion resistance tests, and climate simulation equipment analysis for performance assessment. Approved products are individually vacuum-packed with deoxidizing desiccant inserts and additional protective packaging before shipment, ensuring consistent high-quality delivery, reflecting our commitment to maintaining product integrity from our factory to your hands.





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